参数资料
型号: W947D2HBJX5E
厂商: Winbond Electronics
文件页数: 49/60页
文件大小: 0K
描述: IC LPDDR SDRAM 128MBIT 90VFBGA
标准包装: 240
格式 - 存储器: RAM
存储器类型: 移动 LPDDR SDRAM
存储容量: 128M(4Mx32)
速度: 200MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -25°C ~ 85°C
封装/外壳: 90-TFBGA
供应商设备封装: 90-VFBGA(8x13)
包装: 托盘
W947D6HB / W947D2HB
128Mb Mobile LPDDR
(128Mb, X32)
PARAMETER
SYMBOL
TEST CONDITION
-5
-6
- 75
UNIT
Operating one
tRC = tRCmin ; tCK = tCKmin ; CKE is HIGH; CS is HIGH between valid
bank active-
IDD0
commands; address inputs are SWITCHING; data bus inputs are
40
38
35
mA
precharge current
STABLE
Precharge power-
down standby
current
Precharge power-
down standby
current with clock
stop
IDD2P
IDD2PS
all banks idle, CKE is LOW; CS is HIGH, tCK = tCKmin ;
address and control inputs are SWITCHING; data bus inputs
are STABLE
all banks idle, CKE is LOW; CS is HIGH, CK = LOW,
CK = HIGH; address and control inputs are SWITCHING;
data bus inputs are STABLE
Low
power
Normal
power
Low
power
Normal
power
0.23
0.28
0.23
0.28
0.23
0.28
0.23
0.28
0.23
0.28
0.23
0.28
mA
mA
Precharge non
all banks idle, CKE is HIGH; CS is HIGH, tCK = tCKmin; address and
power-down
IDD2N
control inputs are SWITCHING; data bus
10
10
10
mA
standby current
inputs are STABLE
Precharge non
power-down
standby current
IDD2NS
all banks idle, CKE is HIGH; CS is HIGH, CK = LOW,
CK = HIGH; address and control inputs are SWITCHING; data bus
3
3
3
mA
with clock stop
inputs are STABLE
Active power-
down standby
current
Active power-
down standby
current with clock
stop
Active non
power-down
standby current
Active non
power-down
standby current
with clock stop
Operating burst
read current
Operating burst
write current
Auto-Refresh
Current
Deep Power-
Down current
IDD3P
IDD3PS
IDD3N
IDD3NS
IDD4R
IDD4W
IDD5
IDD8(4)
one bank active, CKE is LOW; CS is HIGH, tCK = tCKmin; address
and control inputs are SWITCHING; data bus inputs are STABLE
one bank active, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are
STABLE
one bank active, CKE is HIGH; CS is HIGH, tCK = tCKmin; address
and control inputs are SWITCHING; data bus inputs are STABLE
one bank active, CKE is HIGH; CS is HIGH, CK = LOW, CK =
HIGH; address and control inputs are SWITCHING; data bus inputs are
STABLE
one bank active; BL = 4; CL = 3; tCK = tCKmin ; continuous read bursts;
IOUT = 0 mA; address inputs are SWITCHING; 50% data change each
burst transfer
one bank active; BL = 4; t CK = t CKmin ; continuous write
bursts; address inputs are SWITCHING; 50% data change
each burst transfer
tRC = tRFCmin ; tCK = tCKmin ; burst refresh; CKE is
HIGH; address and control inputs are SWITCHING; data bus inputs are
STABLE
Address and control inputs are STABLE; data bus inputs are STABLE
3
3
25
15
75
55
50
10
3
3
20
12
70
50
50
10
3
3
20
12
70
50
50
10
mA
mA
mA
mA
mA
mA
mA
uA
Notes:
1.
2.
3.
4.
IDD specifications are tested after the device is properly initialized.
Input slew rate is 1V/ns.
Definitions for IDD:
LOW is defined as V IN ≤ 0.1 * V DDQ ;HIGH is defined as V IN ≥ 0.9 * V DDQ ;STABLE is defined as inputs stable at a HIGH or LOW level;
SWITCHING is defined as:
- Address and command: inputs changing between HIGH and LOW once per two clock cycles;
- Data bus inputs: DQ changing between HIGH and LOW once per clock cycle; DM and DQS are STABLE.
IDD8 are typical value at 25 ℃ .
Publication Release Date:Jun,17, 2011
- 49 -
Revision A01-003
相关PDF资料
PDF描述
W948D2FBJX5E IC LPDDR SDRAM 256MBIT 90VFBGA
W949D2CBJX5E IC LPDDR SDRAM 512MBIT 90VFBGA
W971GG6JB25I IC DDR2 SDRAM 1GBIT 84WBGA
W971GG8JB-25 IC DDR2 SDRAM 1GBIT 60WBGA
W9725G6IB-25 IC DDR2-800 SDRAM 256MB 84-WBGA
相关代理商/技术参数
参数描述
W947D2HBJX5I 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W947D2HBJX6E 制造商:Winbond Electronics Corp 功能描述:IC LPDDR SDRAM 128MBIT 90VFBGA
W947D2HBJX6G 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W947D6HB 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W947D6HBHX5E 功能描述:IC LPDDR SDRAM 128MBIT 60VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G(256M x 16) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6