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| 型号： | W9751G6KB-25 |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/87页 |
| 文件大小： | 0K |
| 描述： | IC DDR2 SDRAM 512MBIT 84WBGA |
| 标准包装： | 209 |
| 格式 - 存储器： | RAM |
| 存储器类型： | DDR2 SDRAM |
| 存储容量： | 512M（32Mx16） |
| 速度： | 2.5ns |
| 接口： | 并联 |
| 电源电压： | 1.7 V ~ 1.9 V |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 84-TFBGA |
| 供应商设备封装： | 84-WBGA（8x12.5） |
| 包装： | 托盘 |
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W9751G6KB
8.4.1.1
8.4.2
8.4.3
8.4.4
8.4.5
Examples of posted CAS operation...................................................................... 23
Burst mode operation ....................................................................................................... 24
Burst read mode operation ............................................................................................... 25
Burst write mode operation .............................................................................................. 25
Write data mask ............................................................................................................... 26
8.5
8.6
Burst Interrupt ..................................................................................................................................... 26
Precharge operation ............................................................................................................................ 27
8.6.1
8.6.2
Burst read operation followed by precharge ..................................................................... 27
Burst write operation followed by precharge .................................................................... 27
8.7
Auto-precharge operation ................................................................................................................... 27
8.7.1
8.7.2
Burst read with Auto-precharge........................................................................................ 28
Burst write with Auto-precharge ....................................................................................... 28
8.8
8.9
Refresh Operation ............................................................................................................................... 29
Power Down Mode .............................................................................................................................. 29
8.9.1
8.9.2
Power Down Entry ........................................................................................................... 30
Power Down Exit .............................................................................................................. 30
9.
10.
8.10
9.1
9.2
9.3
9.4
9.5
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
10.11
Input clock frequency change during precharge power down ............................................................. 30
OPERATION MODE ........................................................................................................................... 31
Command Truth Table ........................................................................................................................ 31
Clock Enable (CKE) Truth Table for Synchronous Transitions............................................................ 32
Data Mask (DM) Truth Table ............................................................................................................... 32
Function Truth Table ........................................................................................................................... 33
Simplified Stated Diagram ................................................................................................................... 36
ELECTRICAL CHARACTERISTICS ................................................................................................... 37
Absolute Maximum Ratings................................................................................................................. 37
Operating Temperature Condition ....................................................................................................... 37
Recommended DC Operating Conditions ........................................................................................... 38
ODT DC Electrical Characteristics ...................................................................................................... 38
Input DC Logic Level ........................................................................................................................... 38
Input AC Logic Level ........................................................................................................................... 38
Capacitance ........................................................................................................................................ 39
Leakage and Output Buffer Characteristics ........................................................................................ 39
DC Characteristics .............................................................................................................................. 40
IDD Measurement Test Parameters .......................................................................................... 42
AC Characteristics ..................................................................................................................... 43
10.12
10.13
10.14
10.11.1
10.11.2
10.14.1
10.14.2
AC Characteristics and Operating Condition for -18 speed grade ................................... 43
AC Characteristics and Operating Condition for -25/25I/25A/25K/-3 speed grade ........... 45
AC Input Test Conditions ........................................................................................................... 66
Differential Input/Output AC Logic Levels .................................................................................. 66
AC Overshoot / Undershoot Specification ................................................................................. 67
AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 67
AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 67
11.
TIMING WAVEFORMS ....................................................................................................................... 68
Publication Release Date: Sep. 03, 2012
-2-
Revision A04
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W9751G6KB25A | 制造商:WINBOND 制造商全称:Winbond 功能描述:Double Data Rate architecture: two data transfers per clock cycle |
| W9751G6KB25I | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 512MBIT 2.5NS BGA |
| W9751G6KB25K | 制造商:WINBOND 制造商全称:Winbond 功能描述:Double Data Rate architecture: two data transfers per clock cycle |
| W9751G6KB25TR | 制造商:Winbond Electronics Corp 功能描述:512M DDR2-800, X16 制造商:Winbond 功能描述:512M DDR2-800, X16 |
| W9751G6KB-3 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Double Data Rate architecture: two data transfers per clock cycle |
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