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| 型号： | 440EP |
| 厂商： | Applied Micro Circuits Corp. |
| 英文描述： | Power PC 440EP Embedded Processor |
| 中文描述： | 440EP的Power PC嵌入式处理器 |
| 文件页数： | 59/84页 |
| 文件大小： | 541K |
| 代理商： | 440EP |
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62
AMCC Proprietary
440EP – PPC440EP Embedded Processor
Revision 1.26 – April 25, 2007
Data Sheet
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
Table 12. DC Power Supply Current Loads
Parameter
Symbol
Typical
Maximum
Unit
Notes
VDD (1.5V) active operating current
IDD
1380
2200
mA
OVDD (3.3V) active operating current
IODD
10
100
mA
SVDD (2.5V) active operating current
ISDD
460
600
mA
AVDD (1.5V) input current
IADD
3.2
5
mA
1
SAVDD (1.5V) active operating current
ISADD
6.05
10
mA
1
Notes:
1. See “Absolute Maximum Ratings” on page 59 for filter recommendations.
2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors
including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,
and the power supply voltages. Your specific application can produce significantly different results. VDD current and power are primarily
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD current and power
are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
3. Typical current is estimated at 667MHz with VDD = +1.5V, OVDD = +3.3V, SVDD = +2.5V, and TC = +85°C, while running Linux and a test
application that exercises each core with representative traffic.
4. Maximum current is estimated at 667MHz with VDD = +1.6V, OVDD = +3.6V, SVDD = +2.7V, TC = +85°C, and a best-case process (which
drives worst-case power), while running Linux and a test application that exercises each core with representative traffic.
Table 13. Package Thermal Specifications
Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:
Parameter
Symbol
Package
Airflow
ft/min (m/sec)
Unit
Notes
0 (0)
100 (0.51)
200 (1.02)
Junction-to-ambient thermal resistance
without heat sink
θ
JA
E-PBGA
20.0
18.7
17.9
°C/W
Junction-to-ambient thermal resistance
with heat sink
θ
JA
E-PBGA
15.3
11.9
10.5
°C/W
Resistance Value
Junction-to-case thermal resistance
θ
JC
E-PBGA
8.3
°C/W
Junction-to-board thermal resistance
θ
JB
E-PBGA
14.3
°C/W
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. TA = TC - P×θCA, where TA is ambient temperature and P is power consumption.
3. TCMax = TJMax - P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
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相关代理商/技术参数 |
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| 440E-P13045 | 制造商:ALLEN-BRADLEY 制造商全称:Allen-Bradley 功能描述:440H-P03035 |
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| 440ES001B1434-4 | 功能描述:环形MIL规格后盖 CRIMIP RING ADPTR DC STRAIGHT RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440ES031M1633-3B | 功能描述:环形MIL规格后盖 BND/SHRNK BOOT ADPTR DC STRAIGHT BAND RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440ES031M2003-3B | 功能描述:环形MIL规格后盖 BND/SHRNK BOOT ADPTR DC STRAIGHT BAND RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
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