参数资料
型号: A8582KLPTR-T
厂商: Allegro Microsystems Inc
文件页数: 2/32页
文件大小: 0K
描述: IC REG BUCK ADJ 2A 16TSSOP
标准包装: 1
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 可调至 0.8V
输入电压: 4.7 V ~ 36 V
PWM 型: 电流模式
频率 - 开关: 250kHz ~ 2.45MHz
电流 - 输出: 2A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm)裸露焊盘
包装: 标准包装
供应商设备封装: 16-TSSOP-EP
其它名称: 620-1395-6
A8582
Description (continued)
Wide Input Voltage, 2.4 MHz , 2.0 A
Asynchronous Buck Regulator
every PWM cycle. This improves light load efficiency and provides
no-load currents as low as 4 mA at 2 MHz. The sleep mode current
of the A8582 control circuitry is less than 3 μ A.
Protection features include VIN undervoltage lockout (UVLO),
pulse-by-pulse overcurrent protection (OCP), hiccup mode short-
circuit protection (HIC), overvoltage protection (OVP), and thermal
shutdown (TSD). In addition, the A8582 provides unique missing
Selection Guide
diode (D1) protection, open-circuit, adjacent pin short-circuit,
and short-to-ground protection at every pin to satisfy the most
demanding applications.
The A8582 device is available in a 16-pin TSSOP package with
exposed pad for enhanced thermal dissipation. It is lead (Pb) free,
with 100% matte tin leadframe plating.
Part Number
A8582KLPTR-T
Packing
4000 pieces per 13-in. reel
Absolute Maximum Ratings 1
Characteristic
VIN Pin to GND
SW Pin to GND 2
BOOT Pin Above SW Pin
SS Pin
All Other Pins
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
Symbol
V IN
V SW
V BOOT
V SS
V I
T A
T J (max)
T stg
Notes
Continuous
Single pulse, t W < 50 ns
K temperature range for automotive
Rating
–0.3 to 40
–0.3 to V IN + 0.3
–1.0 to V IN + 5.0
V SW – 0.3 to
V SW + 7.0
–0.3 to V IN + 0.3
–0.3 to 5.5
–40 to 125
150
–55 to 150
Unit
V
V
V
V
V
V
oC
oC
oC
1 Stresses
beyond those listed in this table may cause permanent damage to the device. The absolute maximum ratings are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the Electrical
Characteristics table is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
2 SW has internal clamp diodes to GND and VIN. Applications that forward bias these diodes should take care not to exceed the IC
package power dissipation limits.
Thermal Characteristics
Characteristic
Package Thermal Resistance
Symbol
R θ JA
Test Conditions*
On 4-layer PCB based on JEDEC standard
Value
34
Unit
oC/W
*Additional thermal information available on the Allegro website
Table of Contents
Specifications
Functional Block Diagram
Pin-out Diagram and Terminal List
Typical Characteristic Performance
Functional Description
2
3
4
8
10
Overview
Protection Features
Application Information
Design and Component Selection
Package Outline Drawing
Allegro MicroSystems, LLC
115 Northeast Cutoff
10
14
16
16
30
2
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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