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| 型号： | 403GC-3BA40C1 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 40 MHz, RISC PROCESSOR, PBGA160 |
| 封装： | PLASTIC, BGA-160 |
| 文件页数： | 14/48页 |
| 文件大小： | 768K |
| 代理商： | 403GC-3BA40C1 |
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IBM PowerPC 403GC
21
Package Thermal Specifications
The 403GC is designed to operate within the
case temperature range from -40°C to 120°C.
Thermal resistance values are shown in Table 7:
Notes:
1. Case temperature TmC is measured at top center of
case surface with device soldered to circuit board.
2. TmA = TmC – P×θCA, where TmA is ambient
temperature.
3. TmCMax = TmJMax – P×θJC, where TmJMax is
maximum junction temperature and P is power
consumption.
4. The above assumes that the chip is mounted on a
card with at least one signal and two power planes.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
The absolute maximum ratings in Table 8 below
are stress ratings only. Operation at or beyond
these maximum ratings may cause permanent
damage to the device.
Operating Conditions
The 403GC can interface to either 3V or 5V
technologies. The range for supply voltages is
specified for five-percent margins relative to a
nominal 3.3V power supply.
Device operation beyond the conditions specified
in Table 9 is not recommended. Extended
operation beyond the recommended conditions
may affect device reliability:
Note:
1. These frequencies do not account for TCS. See
Power Considerations
Power dissipation is determined by operating
frequency, temperature, and supply voltage, as
well as external source/sink current
requirements. Typical power dissipation is 0.2 W
at 25 MHz, 0.26 W at 33 MHz, or 0.32 W at 40
MHz, TmC = 55 °C, and VCC = 3.3 V, with an
average 10pF capacitive load.
Estimated supply current as a function of
frequency is shown in the figure, "Supply Current
vs Operating Frequency," on page 30. Derating
curves are provided in the section, "Output
Recommended Connections
Power and ground pins should all be connected
to separate power and ground planes in the
circuit board to which the 403GC is mounted.
Unused input pins must be tied inactive, either
high or low.
The interface voltage reference (IVR) pin should
be connected to 3.3V supply if all signal pins
connecting to the 403GC pins operate at 3V
levels. If any signal pin connecting to the 403GC
operates with 5V levels, the IVR pin should be
connected to 5V supply.
Table 7. Thermal Resistance (°C/Watt)
Parameter
Airflow-ft/min (m/sec)
0
(0)
100
(0.51)
200
(1.02)
θ
JC Junction to case
222
θ
CA Case to ambient
PQFP (no heatsink)
PBGA (no heatsink)
37.2
30
31.6
29.8
Table 8. 403GC Maximum Ratings
Parameter
Maximum Rating
Supply voltage with
respect to GND
-0.5V to +3.8V
Voltage on other pins with
respect to GND
-0.5V to +5.5V
Case temperature under
bias
-40°C to +120°C
Storage temperature
-65°C to +150°C
Table 9. Operating Conditions
Symbol
Parameter
Min Max Unit
VDD
Supply voltage:
PPC403GC-JA25/33/40
403GC-3BA25/33/40
3.14
3.47
V
FC
Clock frequency1:
PPC403GC-JA25/3BA25
PPC403GC-JA33/3BA33
PPC403GC-JA40/3BA40
0
25
33
40
MHz
TmC Case temperature
under bias:
PPC403GC-JA25/33/40
403GC-3BA25/33/40
-40
85
°C
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