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参数资料
| 型号： | MMA7660FCT |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 25/35页 |
| 文件大小： | 0K |
| 描述： | ACCELEROMETER 3X3 DGTL 10-DFN |
| 特色产品： | MMA7660 Digital Output Accelerometer |
| 标准包装： | 490 |
| 轴： | X，Y，Z |
| 加速范围： | ±1.5g |
| 灵敏度： | 21.33 计数/g |
| 电源电压： | 2.4 V ~ 3.6 V |
| 输出类型： | 数字 |
| 接口： | I²C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-VFDFN |
| 供应商设备封装： | 10-DFN（3x3） |
| 产品目录页面： | 2805 (CN2011-ZH PDF) |
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APPENDIX A – PACKAGE REQUIREMENTS FOR MMA7660FC
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder
mask layer to avoid bridging and shorting between solder pads.
Soldering And Mounting Guidelines for the DFN Accelerometer Sensor to a PC Board
These guidelines are for soldering and mounting the Dual Flat No-Lead (DFN) package inertial sensors to printed circuit
boards (PCBs). The purpose is to minimize the stress on the package after board mounting. The MMA7660 digital output
accelerometer uses the DFN package platform. This section describes suggested methods of soldering these devices to the PC
board for consumer applications. Pages 31, 32, and 33 show the package outline drawing for the package.
Overview of Soldering Considerations
Information provided here is based on experiments executed on DFN devices. They do not represent exact conditions present
at a customer site. Hence, information herein should be used as guidance only and process and design optimizations are
recommended to develop an application specific solution. It should be noted that with the proper PCB footprint and solder stencil
designs the package will self-align during the solder reflow process. The following are the recommended guidelines to follow for
mounting DFN sensors for consumer applications.
Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that
no homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight
or bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
Note: Halogen Free is only compliant to the MMA7660FC, not to the packaging material.
PCB Mounting Recommendations
1. The PCB land should be designed with Non Solder Mask Defined (NSMD) as shown in Figure 16 and Figure 17 .
2. No additional via pattern underneath package.
4. Do not solder down smaller side tabs on either end of the package.
5. The solder mask opening is equal to the size of the PCB land pad plus 0.15 mm.
6. The stencil aperture size is equal to the PCB land pad – minus 0.03 mm total.
7. Stencil thickness should be 75 μ m.
8. Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional
package stress if it is too close to the package land area.
9. Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads in order to have same
length of exposed trace for all pads. Signal traces with 0.15 mm width and minimum 0.5 mm length for all PCB land pads
near the package are recommended as shown in Figure 16 and Figure 17 . Wider trace can be continued after the 0.5 mm
zone.
10. Use a standard pick and place process and equipment. Do not use a hand soldering process.
11. It is recommended to use a no clean solder paste.
12. Do not use a screw down or stacking to fix the PCB into an enclosure because this could bend the PCB putting stress on
the package.
13. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature.
14. No copper traces on top layer of PCB under the package. This will cause planarity issues with board mount.
Freescale DFN sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding
compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-
copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for
soldering the devices.
MMA7660FC
Sensors
25
Freescale Semiconductor, Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MMA7660FCT | 制造商:Freescale Semiconductor 功能描述:IC 3 AXIS ACCELEROMETER ?1.5G DFN-10 |
| MMA8104EG | 功能描述:加速计 - 板上安装 SOURCE ONLY RoHS:否 制造商:Murata 传感轴:Double 加速:12 g 灵敏度: 封装 / 箱体: 输出类型:Analog 数字输出 - 位数:11 bit 电源电压-最大:5.25 V 电源电压-最小:4.75 V 电源电流:4 mA 最大工作温度:+ 125 C 最小工作温度:- 40 C |
| MMA8104EGR2 | 功能描述:加速计 - 板上安装 Z-AXIS 40G W/CAP BOND RoHS:否 制造商:Murata 传感轴:Double 加速:12 g 灵敏度: 封装 / 箱体: 输出类型:Analog 数字输出 - 位数:11 bit 电源电压-最大:5.25 V 电源电压-最小:4.75 V 电源电流:4 mA 最大工作温度:+ 125 C 最小工作温度:- 40 C |
| MMA8104KEG | 功能描述:加速计 - 板上安装 SOURCE ONLY RoHS:否 制造商:Murata 传感轴:Double 加速:12 g 灵敏度: 封装 / 箱体: 输出类型:Analog 数字输出 - 位数:11 bit 电源电压-最大:5.25 V 电源电压-最小:4.75 V 电源电流:4 mA 最大工作温度:+ 125 C 最小工作温度:- 40 C |
| MMA8104KEGR2 | 功能描述:加速计 - 板上安装 Z-AXIS 40G W/CAP BOND RoHS:否 制造商:Murata 传感轴:Double 加速:12 g 灵敏度: 封装 / 箱体: 输出类型:Analog 数字输出 - 位数:11 bit 电源电压-最大:5.25 V 电源电压-最小:4.75 V 电源电流:4 mA 最大工作温度:+ 125 C 最小工作温度:- 40 C |
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