- 您现在的位置：买卖IC网 > PDF目录16490 > AD6641-500EBZ (Analog Devices Inc)BOARD EVALUATION FOR AD6641 PDF资料下载
参数资料
| 型号： | AD6641-500EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 2/28页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR AD6641 |
| 设计资源： | AD6641 BOM |
| 标准包装： | 1 |
| 系列： | * |
第1页当前第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
AD6641
Rev. 0 | Page 10 of 28
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DRVDD to DRGND
0.3 V to +2.0 V
AGND to DRGND
0.3 V to +0.3 V
AVDD to DRVDD
2.0 V to +2.0 V
SPI_VDDIO to AVDD
2.0 V to +2.0 V
SPI_VDDIO to DRVDD
2.0 V to +2.0 V
PD[5:0]± to DRGND
0.3 V to DRVDD + 0.2 V
PCLK± to DRGND
0.3 V to DRVDD + 0.2 V
PDOR± to DRGND
0.3 V to DRVDD + 0.2 V
FULL to DRGND
0.3 V to DRVDD + 0.2 V
CLK± to AGND
0.3 V to AVDD + 0.2 V
FILL± to AGND
0.3 V to DRVDD + 0.2 V
DUMP to AGND
0.3 V to DRVDD + 0.2 V
EMPTY to AGND
0.3 V to DRVDD + 0.2 V
VIN± to AGND
0.3 V to AVDD + 0.2 V
VREF to AGND
0.3 V to AVDD + 0.2 V
CML to AGND
0.3 V to AVDD + 0.2 V
CSB to DRGND
0.3 V to SPI_VDDIO + 0.3 V
SP_SCLK, SP_SDFS to AGND
0.3 V to SPI_VDDIO + 0.3 V
SDIO to DRGND
0.3 V to SPI_VDDIO + 0.3 V
SP_SDO to DRGND
0.3 V to SPI_VDDIO + 0.3 V
Environmental
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed pad must be soldered to the ground plane for
the LFCSP package. Soldering the exposed pad to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 7.
Package Type
θJA
θJC
Unit
56-Lead LFCSP_VQ (CP-56-1)
23.7
1.7
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
ESD CAUTION
相关PDF资料 |
PDF描述 |
|---|---|
| EBM30DTBD | CONN EDGECARD 60POS R/A .156 SLD |
| HCC07DRTH-S93 | CONN EDGECARD 14POS DIP .100 SLD |
| 1906051-8 | CA 2MM OFNR 62.5/125,LC SEC RED |
| 1828875-2 | C/A FO LC SEC SC BLUE 62.5 2M |
| A3932SEQ-T | IC CTRLR MOSFET 3PH 32-PLCC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD6641BCPZ-500 | 功能描述:IC IF RCVR 11BIT 200MSPS 56LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| AD6641BCPZRL7-500 | 功能描述:IC IF RCVR 11BIT 200MSPS 56LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| AD6642 | 制造商:AD 制造商全称:Analog Devices 功能描述:Dual IF Receiver |
| AD6642BBCZ | 功能描述:IC IF RCVR 11BIT 200MSPS 144BGA RoHS:是 类别:RF/IF 和 RFID >> RF 其它 IC 和模块 系列:- 标准包装:100 系列:* |
| AD6642BBCZRL | 功能描述:IC IF RCVR 11BIT 200MSPS 144BGA RoHS:是 类别:RF/IF 和 RFID >> RF 其它 IC 和模块 系列:- 标准包装:100 系列:* |
发布紧急采购，3分钟左右您将得到回复。