参数资料
型号: 533522B02552G
厂商: Aavid Thermalloy
文件页数: 94/116页
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
产品培训模块: How to Select a Heat Sink
标准包装: 250
类型: 插件板级,垂直
冷却式包装: TO-220(双)
固定方法: 夹和 PC 引脚
形状: 矩形
长度: 2.000"(50.80mm)
宽: 1.650"(41.91mm)
机座外的高度(散热片高度): 1.000"(25.40mm)
温升时的功耗: 6W @ 30°C
在强制气流下的热敏电阻: 在 800 LFM 时为1.0°C/W
自然环境下的热电阻: 2.7°C/W
材质:
材料表面处理: 黑色阳极化处理
其它名称: 041758
79
OPTIONS
&
A
C
ESSORIES
C
O
NTENT
S
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
CONTENTS
Accessories
Mounting Kits
TO-220/TO-3 Mounting Kits......................................................................................................................... 99
Insulating Shoulder Washers
Polyphenylene Sulfide (PPS) Shoulder Washers................................................................................... 100
Nylon Shoulder Washers................................................................................................................................100
Insulators
ThermalfilmTM Polymide Plastic Films........................................................................................................101
ThermalfilmTM/ ThermalfilmTM MT................................................................................................................ 102
Mica, ThermalsilTMlll.......................................................................................................................................... 103
Aluminum Oxide Ceramic Insulators........................................................................................................ 104
Stanchion Pads..................................................................................................................................................105
Insulating Covers
TO-3 Insulating Covers................................................................................................................................... 106
Teflon-Filled Acetal Insulators..................................................................................................................... 106
Teflon-Filled Acetal Bushings.......................................................................................................................106
Mounting Pads
(TO-5, TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion)................ 107
Finishes .............................................................................................................................................................. 110
Card Ejectors
Snap-On Ejectors.............................................................................................................................................. 111
Standard Ejectors............................................................................................................................................. 111
Thermal Greases and Epoxies
Sil-FreeTM.............................................................................................................................................................. 112
Ther-O-LinkTM..................................................................................................................................................... 112
UltrastickTM.......................................................................................................................................................... 112
ThermalCoteTM................................................................................................................................................... 113
ThermalCoteTM II............................................................................................................................................... 113
Ther-O-BondTM 1500........................................................................................................................................ 114
Ther-O-BondTM 1600........................................................................................................................................ 114
Ther-O-BondTM 2000........................................................................................................................................ 114
ThermalbondTM.................................................................................................................................................. 115
相关PDF资料
PDF描述
542502D00000G BOARD LEVEL HEAT SINK
5519 210 MM X 155 MM X 2.0 MM THERM PAD 5519 210X155MM 2.0MM
5591S 210 MM X 300 MM 2.5 MM THERM PAD 5591S 210X300MM 2.5MM
5592 210 MM X 300 MM 2.0 MM THERM PAD 5592 210X300MM 2.0MM
5595 210 MM X 300 MM 2.0 MM THERM PAD 5595 210X300MM 2.0MM
相关代理商/技术参数
参数描述
533523-000 制造商:TE Connectivity 功能描述:RayOLOn General Purpose Kit 制造商:TE Connectivity 功能描述:LNCL-14-185-GK - Bulk
533525006 制造商:JAEGER 功能描述:RECEPTACLE MINIATURE MALE 37WAY
533531071 制造商:Molex 功能描述:
53353-1071 功能描述:板对板与夹层连接器 0.8 BtB Wafer Assy S T SMT 10CktEmbsTpPkg RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A
53353-1091 制造商:MOLEX 功能描述:0.8MM BTB STR HDER 20CKT 533531091 10CKT TIN 1.8MM