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参数资料
| 型号： | PC2SD11NXPAF |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 10/15页 |
| 文件大小： | 0K |
| 描述： | PHOTOCOUPLER TRIAC OUT 6-SMD |
| 产品目录绘图： | PC Series Circuit |
| 标准包装： | 1 |
| 电压 - 隔离： | 5000Vrms |
| 通道数： | 1 |
| 电压 - 断路： | 400V |
| 输出类型： | 交流标准三端双向可控硅开关 |
| 电流 - 栅极触发电流 (Igt)（最大）： | 10mA |
| 电流 - 保持 (Ih)： | 100µA |
| 电流 - DC 正向(If)： | 50mA |
| 电流 - 输出 / 通道： | 100mA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-SMD |
| 供应商设备封装： | 6-SMD |
| 包装： | 标准包装 |
| 产品目录页面： | 2768 (CN2011-ZH PDF) |
| 其它名称： | 425-2573-6 |
PC2SD11NTZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(?C)
300
Terminal : 260?C peak
( package surface : 250?C peak)
200
Reflow
220?C or more, 60s or less
100
Preheat
150 to 180?C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270?C and within 10s.
Preheating is within the bounds of 100 to 150?C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400?C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A07401EN
10
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