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参数资料
型号： MPC8536AVTAKGA
厂商： Freescale Semiconductor
文件页数： 30/126页
文件大小： 0K
描述： MPU POWERQUICC III 783FCPBGA
标准包装： 1
系列： MPC85xx
处理器类型： 32-位 MPC85xx PowerQUICC III
速度： 600MHz
电压： 1V
安装类型： 表面贴装
封装/外壳： 783-BBGA，FCBGA
供应商设备封装： 783-FCPBGA（29x29）
包装： 托盘
Product Documentation
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
125
2.
Dimensions and tolerances per ASME Y14.5M-1994.
3.
Maximum solder ball diameter measured parallel to datum A
4.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5.
Capacitors may not be present on all devices
6.
Caution must be taken not to short exposed metal capacitor pads on package top.
7.
All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
6
Product Documentation
The following documents are required for a complete description of the chip and are needed to design properly with the part.
MPC8536E PowerQUICC III Integrated Processor Reference Manual (document number: MPC8536ERM)
e500 PowerPC Core Reference Manual (document number: E500CORERM)
7
Document Revision History
This table provides a revision history for this hardware specification.
Table 85. Document Revision History
Revision
Date
Substantive Change(s)
5
09/2011
Removed PVDD from Table 1, “Pinout Listing.”
4
06/2011
In Table 1, “Pinout Listing,” updated the power supply for TSEC3 pins to TVDD.
Updated Table 56, “eSDHC AC Timing Specifications.”
In Section 4.3, “Part Numbering,” added an extra bin (1250/500/667) to support DDR3.
3
11/2010
In Table 1, “Pinout Listing,” added the following note: “For systems that boot from Local Bus
(GPCM)-controlled NOR flash or (FCM) controlled NAND flash, a pullup on LGPL4 is required...”
In addition, updated footnote 26 and added footnote 29 to PCI1_AD.
Updated Table 21
Updated Figure 25, “RGMII and RTBI AC Timing and Multiplexing Diagrams.”
In Table 44, “MII Management DC Electrical Characteristics,” changed the Voh/Vol values for
MDIO/MDC.
Added Note 6 regarding USB
n_DIR pin to Table 47, “USB General Timing Parameters6.”
In Table 64, “I2C AC Electrical Specifications,” updated footnote 2.
In Table 82, Table 83, Table 84, added the Revision Level A for Rev 1.2
2
09/2009
Note:
In Section 1, “Pin Assignments and Reset States,”updated the first sentence of the note to say, “The
UART_SOUT[0:1] and TEST_SEL pins must be set to a proper state during POR configuration.”
In Table 40, “SGMII DC Receiver Electrical Characteristics,” changed LSTSAB to LSTSA and
LSTSEF to LSTSE for Note 4.
Note: Updated Figure 81, “Mechanical Dimensions and Bottom Surface Nomenclature of the
FC-PBGA,” and its notes.
1
09/2009
In Table 5, ”Power Dissipation 5,” changed an “—”’ to “0.”
0
08/2009
Initial public release.
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MPC8536AVTANG 功能描述:微处理器 - MPU 8536 COMMERCIAL 800 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536AVTANGA 功能描述:微处理器 - MPU 8536 Non E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536AVTAQG 功能描述:微处理器 - MPU 8536 COMMERCIAL 1000 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536AVTAQGA 功能描述:微处理器 - MPU 8536 Non E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536AVTATH 功能描述:微处理器 - MPU 8536 COMMERCIAL 1250 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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