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| 型号： | DSPB56725CAF |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 45/48页 |
| 文件大小： | 0K |
| 描述： | IC DSP 24BIT 80LQFP |
| 标准包装： | 90 |
| 系列： | DSP56K/Symphony |
| 类型： | 音频处理器 |
| 接口： | 主机接口，I²C，SAI，SPI |
| 时钟速率： | 200MHz |
| 非易失内存： | 外部 |
| 芯片上RAM： | 112kB |
| 电压 - 输入/输出： | 3.30V |
| 电压 - 核心： | 1.00V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 80-LQFP |
| 供应商设备封装： | 80-LQFP（14x14） |
| 包装： | 托盘 |
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Symphony DSP56724/ DSP56725 Multi-Core Audio Processors, Rev. 2
Freescale Semiconductor
6
1.1.2
Thermal Characteristics
Table 3 lists the thermal characteristics.
1.1.3
Power Requirements
To prevent high current conditions due to possible improper sequencing of the power supplies, use an external Schottky diode
as shown in Figure 3, connected between the DSP56724/DSP56725 IO_VDD and Core_VDD power pins.
Figure 3. Prevent High Current Conditions by Using External Schottky Diode
If an external Schottky diode is not used (to prevent a high current condition at power-up), then IO_VDD must be applied ahead
of Core_VDD, as shown in Figure 4.
Figure 4. Prevent High Current Conditions by Applying IO_VDD Before Core_VDD
Table 3. Thermal Characteristics
Characteristic
Symbol
LQFP Values
Unit
Natural Convection, Junction-to-ambient thermal
resistance1,2
Single layer board
(1s)
RθJA or θJA
57 for 80 QFP
49 for 144 QFP
°C/W
Four layer board
(2s2p)
44 for 80 QFP
40 for 144 QFP
°C/W
Junction-to-case thermal resistance3
—RθJC or θJC
10 for 80 QFP
9 for 144 QFP
°C/W
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1).
IO_VDD
Core_VDD
External
Schottky
Diode
Core_VDD
IO_VDD
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