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参数资料
| 型号： | BD9141MUV-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 17/21页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 2A 20VQFN |
| 产品培训模块： | High Efficiency Current Mode Switching Regulators CMOS LDO Regulators |
| 特色产品： | BD91x Series Step-Down Regulators |
| 标准包装： | 1 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2.5 V ~ 6 V |
| 输入电压： | 4.5 V ~ 13.2 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 500kHz |
| 电流 - 输出： | 2A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 包装： | 标准包装 |
| 供应商设备封装： | VQFN020V4040 |
| 产品目录页面： | 1373 (CN2011-ZH PDF) |
| 其它名称： | BD9141MUV-E2DKR |
BD9141MUV
Datasheet
7. Input to IC terminals
This is a monolithic IC with P isolation between P-substrate and each element as illustrated below.
This P-layer and
● Operational Notes
1. Absolute Maximum Ratings
While utmost care is taken to quality control of this product, any application that may exceed some of the absolute
maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken,
short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the
absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses.
2. Electrical potential at GND
GND must be designed to have the lowest electrical potential In any operating conditions.
3. Short-circuiting between terminals, and mismounting
When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may
result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and
power supply or GND may also cause breakdown.
4. Operation in Strong electromagnetic field
Be noted that using the IC in the strong electromagnetic radiation can cause operation failures.
5. Thermal shutdown protection circuit
Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to
protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not
be used thereafter for any operation originally intended.
6. Inspection with the IC set to a pc board
If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the
capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper
grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the
inspection process, be sure to turn OFF the power supply before it is connected and removed.
+
the N-layer of each element form a P-N junction, and various parasitic element are formed.
If a resistor is joined to a transistor terminal as shown in Fig 38.
○ P-N junction works as a parasitic diode if the following relationship is satisfied;
GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and
○ if GND>Terminal B (at NPN transistor side),
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.
The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in
activation of parasitic elements.
Pin A
Resistor
Pin B
C
B
Transistor (NPN)
Pin B
Pin A
E
P +
P P +
P +
P P +
element
N
N
Parasitic element
N
P substrate
GND
Parasitic
element
N
Parasitic element
N
N
P substrate
GND GND
B C
E
Parasitic
GND
Other adjacent elements
Fig.38 Simplified structure of monorisic IC
8. Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
9. Selection of inductor
It is recommended to use an inductor with a series resistance element (DCR) 0.1 Ω or less. When using an inductor over
0.1 Ω , be careful to ensure adequate margins for variation between external devices and this IC, including transient as well
as static characteristics. Furthermore, in any case, it is recommended to start up the output with EN after supply voltage is
within operation range
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
?2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
17/19
TSZ02201-0J3J0AJ00180-1-2
02.MAR.2012 Rev.001
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