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参数资料
| 型号： | 440GP |
| 厂商： | Applied Micro Circuits Corp. |
| 英文描述： | Power PC 440GP Embedded Processor |
| 中文描述： | 440GP的Power PC嵌入式处理器 |
| 文件页数： | 53/83页 |
| 文件大小： | 773K |
| 代理商： | 440GP |
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440GP – Power PC 440GP Embedded Processor
AMCC
57
Revision 1.07 – October 4, 2007
Data Sheet
Heat Sink Mounting Information (Ceramic Package Only)
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat
sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be
attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a
mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive
mechanical stress on bonding of the chip to the substrate and the package to the board.
Heat Sink Attached With Spring Clip
Heat Sink Attached With Adhesive
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the
shock and vibration effects of any particular application.
Heat sink
Thermal grease
Printed
circuit
board
CBGA
package
Heat sink
Heat sink clip
Printed
circuit
board
CBGA
package
Spring clip to board
Spring clip to package
Thermal grease
Heat sink clip
Static compression (spring force)—2.27kg maximum
Static compression (spring force)—2.27kg maximum1
Note 1: Force is limited by allowable compression on the die.
Allowable package compression force is 4.4kg.
Heat sink
Printed
circuit
board
CBGA
package
Adhesive
Heat sink
Printed
circuit
board
CBGA
package
Adhesive
Heat sink weight force—60g maximum
Weight
force
Weight
force
相关PDF资料 |
PDF描述 |
|---|---|
| 440GRX | PowerPC 440GRx Embedded Processor |
| 440GR | Power PC 440GR Embedded Processor |
| 440GX | Power PC 440GX Embedded Processor |
| 440SPE | PowerPC 440SPe Embedded Processor |
| 440SP | PowerPC 440SP Embedded Processor |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 440GR | 制造商:AMCC 制造商全称:Applied Micro Circuits Corporation 功能描述:Power PC 440GR Embedded Processor |
| 440GRX | 制造商:AMCC 制造商全称:Applied Micro Circuits Corporation 功能描述:PowerPC 440GRx Embedded Processor |
| 440GS001NF1934-4 | 功能描述:环形MIL规格后盖 CRIMIP RING ADPTR DC STRAIGHT RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440GS001NF2535-4 | 功能描述:环形MIL规格后盖 CRIMIP RING ADPTR DC STRAIGHT RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440GS031B2912-4 | 制造商:Glenair Inc 功能描述:Shrink Boot Adapters 180° 29 Shell Size Olive Drab Cadmium Aluminum Direct 制造商:Glenair 功能描述:Shrink Boot Adapters 180° 29 Shell Size Olive Drab Cadmium Aluminum Direct |
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