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参数资料
| 型号： | S25FL064A0LNAI00 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | 64M X 1 FLASH 3V PROM, PDSO16 |
| 封装： | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 |
| 文件页数： | 3/36页 |
| 文件大小： | 1495K |
| 代理商： | S25FL064A0LNAI00 |
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S25FL064A
S25FL064A_00_C3 June 29, 2007
Da ta
Sh e e t
7.
Device Operations
All Spansion SPI devices (S25FL-A) accept and output data in bytes (8 bits at a time).
7.1
Byte or Page Programming
Programming data requires two commands: Write Enable (WREN), which is one byte, and a Page Program
(PP) sequence, which consists of four bytes plus data. The Page Program sequence accepts from 1 byte up
to 256 consecutive bytes of data (which is the size of one page) to be programmed in one operation.
Programming means that bits can either be left at 0, or programmed from 1 to 0. Changing bits from 0 to 1
requires an erase operation. Before this can be applied, the bytes of the memory need to be first erased to all
1’s (FFh) before any programming.
7.2
Sector Erase / Bulk Erase
The Sector Erase (SE) and Bulk Erase (BE) commands set all the bits in a sector or the entire memory array
to 1. While bits can be individually programmed from a 1 to 0, erasing bits from 0 to 1 must be done on a
sector-wide (SE) or array-wide (BE) level.
7.3
Monitoring Write Operations Using the Status Register
The host system can determine when a Write Status Register, program, or erase operation is complete by
monitoring the Write in Progress (WIP) bit in the Status Register. The Read from Status Register command
provides the state of the WIP bit.
7.4
Active Power and Standby Power Modes
The device is enabled and in the Active Power mode when Chip Select (CS#) is Low. When CS# is high, the
device is disabled, but may still be in the Active Power mode until all program, erase, and Write Status
Register operations have completed. The device then goes into the Standby Power mode, and power
consumption drops to ISB. The Deep Power Down (DP) command provides additional data protection against
inadvertent signals. After writing the DP command, the device ignores any further program or erase
commands, and reduces its power consumption to IDP.
7.5
Status Register
The Status Register contains the status and control bits that can be read or set by specific commands
Write In Progress (WIP): Indicates whether the device is performing a Write Status Register, program or
erase operation.
Write Enable Latch (WEL): Indicates the status of the internal Write Enable Latch.
Block Protect (BP2, BP1, BP0): Non-volatile bits that define memory area to be software-protected
against program and erase commands.
Status Register Write Disable (SRWD): Places the device in the Hardware Protected mode when this bit
is set to 1 and the W# input is driven low. In this mode, the non-volatile bits of the Status Register (SRWD,
BP2, BP1, BP0) become read-only bits.
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相关代理商/技术参数 |
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|---|---|
| S25FL064K | 制造商:SPANSION 制造商全称:SPANSION 功能描述:64-Mbit CMOS 3.0 Volt Flash Memory with 80-MHz SPI (Serial Peripheral Interface) Multi I/O Bus |
| S25FL064K0SMFI010 | 功能描述:闪存 IC 64MBIT CMOS 3V FL MEMORY 80-MHZ SPI RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| S25FL064K0SMFI011 | 功能描述:闪存 IC 64MBIT CMOS 3V FL MEMORY 80-MHZ SPI RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| S25FL064K0SMFI013 | 制造商:Spansion 功能描述:FLASH SERL-SPI 3V/3.3V 64MBIT - Bulk |
| S25FL064LABBHI020 | 功能描述:IC FLASH NOR 24FBGA 制造商:cypress semiconductor corp 系列:FL-L 包装:托盘 零件状态:在售 存储器类型:非易失 存储器格式:闪存 技术:FLASH - NOR 存储容量:64Mb （8M x 8） 时钟频率:108MHz 写周期时间 - 字，页:- 存储器接口:SPI - 四 I/O， QPI 电压 - 电源:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:24-TBGA 供应商器件封装:24-BGA（6x8） 标准包装:338 |
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