参数资料
型号: NCP5314MNR2
厂商: ON Semiconductor
文件页数: 28/29页
文件大小: 0K
描述: IC CTRLR BUCK CPU 2/3/4PH 32QFN
产品变化通告: Product Discontinuation 30/Jun/2004
标准包装: 1
应用: 控制器,CPU
输入电压: 9.5 V ~ 13.2 V
输出数: 4
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-QFN(5x5)
包装: 剪切带 (CT)
其它名称: NCP5314MNR2OSCT
NCP5314
PACKAGE DIMENSIONS
32 LEAD LQFP
CASE 873A?02
ISSUE C
A
4X
32
A1
25
0.20 (0.008) AB T?U Z
?T?
1
?U?
P
AE
B
V
AE
B1
8
DETAIL Y
17
V1
DETAIL Y
BASE
METAL
N
9
9
S1
?Z?
4X
0.20 (0.008) AC T?U Z
F
D
S
SEATING
PLANE
?AB?
?AC?
G
0.10 (0.004) AC
DETAIL AD
C E
H
8X
M _
W
K
R
Q _
J
SECTION AE?AE
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE ?AB? IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS ?T?, ?U?, AND ?Z? TO BE
DETERMINED AT DATUM PLANE ?AB?.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE ?AC?.
6. DIMENSIONS A AND B DO NOT
INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE
?AB?.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600
0.300 0.450
1.350 1.450
0.300 0.400
0.800 BSC
0.050 0.150
0.090 0.200
0.450 0.750
12 _ REF
0.090 0.160
0.400 BSC
1 _ 5 _
0.150 0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.018 0.030
12 _ REF
0.004 0.006
0.016 BSC
1 _ 5 _
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
MAY VARY FROM DEPICTION.
http://onsemi.com
28
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