参数资料
| 型号： | MV-101-27E |
| 厂商： | Ohmite |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | HEATSINK W/CLIP - TO-247/TO-264 |
| 标准包装： | 1 |
| 系列： | M |
| 类型： | 顶部安装 |
| 冷却式包装： | TO-247 和 TO-264 |
| 固定方法： | 夹和 PC 引脚 |
| 形状： | 矩形 |
| 长度： | 1.060"（26.92mm） |
| 宽： | 1.350"（34.30mm） |
| 机座外的高度（散热片高度）： | 1.520"（38.61mm） |
| 自然环境下的热电阻： | 9.6°C/W |
| 材质： | 铝 |
| 材料表面处理： | 无表面处理 |
1-866-9-OHMITE Int’l 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info@ohmite.com
M Series Heatsinks
Heatsink with clips for TO-264 and TO-247
Thermal
Surface Area
Weight Resistance
Part No.
(in2/mm2)
(oz./g)
(°c/w)*
MV-102-55E
45 / 29,097
2.2 / 63
6.0
MA-102-55E
45 / 29,097
2.2 / 63
5.2
MV-101-27E
22 / 14,284
1.1 / 31
9.6
MA-101-27E
22 / 14,284
1.1 / 31
8.0
MV-302-55E
76 / 49,218
4.7 / 134
3.6
MA-302-55E
76 / 49,218
4.7 / 134
3.0
MV-301-27E 37.3 / 24,161
2.3 / 66
5.5
MA-301-27E 37.3 / 24,161
2.3 / 66
4.6
* R-thetac-a for 18W dissipation total for two devices in natural convection
THERMAL
MANAGEMENT
HEATSINK
Fea ture S
Minimumassemblycostandlabor.SpringClips
makethemountingholesandfastenersobsoletein
assemblyoperations&reducecosts.
MaximumThermalTransfer.Maximumsurfacearea
perunitvolume,efficientcoolingfins&consistent
mountingforcereducesthermalresistance
MaximumRepeatability.Constantspringforceover
repeatedassembly/disassembly
MaximumReliability.Resilientspringactionlocks
electroniccomponentinplace.Fewerpartsin
assemblyandnofastenersandwashersrequired.
Preventshortcircuitbyeliminatingmetalparticles
generatedfromhardwareorthreadtapping
DesignFlexibility.Maximumflexibilityfordynamic
devicelocationsandpowerupgrading.“Configure-
to-Fit”&“Scale-to-Meet”optionsgivedesignersthe
totalfreedomtoconfiguretheheatsinktofittheir
packagingdesignsandtoscaletheheatsinkto
meettheirpowerdissipations.
C H ara C teri S ti CS
Heat Sink Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized
finish.
Spring Clip Music Wire, Per ASTM A228 with bright nickel plating
Solder Foot Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS com-
pliant.
Interface thermal resistance Thermal joint compound or 0.005 Grafoil (TGon 800 by Laird)
Interface electrical isolation Sil-Pad 900S by Bergquist or equivalent
S erie S S pe C i F i C ation S
OhmiteintroducestheMseries,patented(Pat.No.
7,151,669),highperformance,lowcost,configu-
rable,scalableandcompactheatsinkwithmatrixclip
systemforTO-247andTO-264packages.Thispow-
erfulheatsinkprovidestheeasiestassembly,largest
surfaceareaandsmallestfootprint.Itistheideal
typeofheatsinkforhighpowerdensityandsmall
size(1Uor2U)electronicpackagingwithforcedcon-
vectioncooling.
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