参数资料
型号: MPC7410VS500LE
厂商: Freescale Semiconductor
文件页数: 46/56页
文件大小: 0K
描述: IC MPU PPC 500MHZ 360-FCCLGA
标准包装: 44
系列: MPC74xx
处理器类型: 32-位 MPC74xx PowerPC
速度: 500MHz
电压: 1.8V
安装类型: 表面贴装
封装/外壳: 360-CLGA,FCCLGA
供应商设备封装: 360-FCCLGA(25x25)
包装: 托盘
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
50
Freescale Semiconductor
Document Revision History
1.1
Internal release.
Table 12—added note 16 for ABB/AMON and DBB/DMON signal clarification.
Table 12—changed CHK note 4 reference to note 2, signal is for factory test only. Changed previous
note 4 (CHK related) to now provide additional PLL info.
Table 1—modified maximum value for OVDD from –0.3 to 3.465 to now be –0.3 to 3.6 and L2OVDD
from –0.3 to 2.6 to now be –0.3 to 2.8. Modified note 6, OVDD for revisions prior to Rev. 1.4 have
maximum value for OVDD of –0.3 to 2.8.
Table 8—removed note 12. L2_TSTCLK is for factory use only (see Table 12, note 2).
Section 1.10.2—revised section to include nomenclature tables for part markings not covered by this
spec.
Figure 2—added that under/overshoot for L2OVDD references tL2CLK while OVDD references tSYSCLK.
Table 4—added HCTE package (HX package descriptor) thermal characteristics.
Section 1.5—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same pin assignments.
Section 1.6—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same pinout listings.
Section 1.7—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same package parameters and dimensions.
Table 17—added HCTE package (HX package descriptor) to part numbering nomenclature.
Table 21—added MPC7410THXnnnLE extended temperature HCTE package part numbers and part
number specification document reference.
Table 16. Document Revision History (continued)
Revision
Date
Substantive Change(s)
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