参数资料
型号: MPC7410VS500LE
厂商: Freescale Semiconductor
文件页数: 40/56页
文件大小: 0K
描述: IC MPU PPC 500MHZ 360-FCCLGA
标准包装: 44
系列: MPC74xx
处理器类型: 32-位 MPC74xx PowerPC
速度: 500MHz
电压: 1.8V
安装类型: 表面贴装
封装/外壳: 360-CLGA,FCCLGA
供应商设备封装: 360-FCCLGA(25x25)
包装: 托盘
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
45
System Design Information
Figure 29 describes the thermal performance of selected thermal interface materials.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be
selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration
requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the
following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
0
0.5
1
1.5
2
0
10
20
3040506070
80
Silicone Sheet (0.006")
Bare Joint
Floroether Oil Sheet (0.007")
Graphite/Oil Sheet (0.005")
Synthetic Grease
Contact Pressure (psi)
Spec
if
ic
Ther
m
a
lResi
st
ance
(K
-i
n.
2
/W
)
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