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参数资料
| 型号： | A3989SEVTR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 10/13页 |
| 文件大小： | 0K |
| 描述： | IC STEPPER/MOTOR DRIVER 36-QFN |
| 标准包装： | 1 |
| 应用： | 直流电机驱动器，步进电机驱动器 |
| 输出数： | 2 |
| 电压 - 负载： | 8 V ~ 36 V |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 36-VFQFN 裸露焊盘 |
| 供应商设备封装： | 36-QFN-EP（6x6） |
| 包装： | 标准包装 |
| 产品目录页面： | 1141 (CN2011-ZH PDF) |
| 其它名称： | 620-1183-6 |
A3989
Bipolar Stepper and High Current DC Motor Driver
Applications Information
Motor Configurations For applications that require either dual
DC or dual stepper motors, Allegro offers the A3988 and A3995.
Both devices are offered in a 36 pin QFN package. Please refer to
the Allegro website for further information and datasheets for the
devices.
Layout The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3989 must be soldered directly onto the board. On the under-
side of the A3989 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
Grounding In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground , located very close to the
device. By making the connection between the exposed thermal
pad and the groundplane directly under the A3989, that area
becomes an ideal location for a star ground point.
A low impedance ground will prevent ground bounce during
high current operation and ensure that the supply voltage remains
stable at the input terminal. The recommended PCB layout shown
VBB
in the diagram below, illustrates how to create a star ground
under the device, to serve both as low impedance ground point
and thermal path.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor should be closer to the pins than the bulk capacitor. This is
necessary because the ceramic capacitor will be responsible for
delivering the high frequency current components.
Sense Pins The sense resistors, RS x , should have a very
low impedance path to ground, because they must carry a large
current while supporting very accurate voltage measurements
by the current sense comparators. Long ground traces will cause
additional voltage drops, adversely affecting the ability of the
comparators to accurately measure the current in the windings.
As shown in the layout below, the SENSE x pins have very short
traces to the RS x resistors and very thick, low impedance traces
directly to the star ground underneath the device. If possible,
there should be no other components on the sense circuits.
Note: When selecting a value for the sense resistors, be sure not to
exceed the maximum voltage on the SENSE x pins of ±500 mV.
V BB
CVCP
CCP
CVCP
CIN3
GND
GND
CCP
CIN3
RS1
RS3
1
NC
MODE
OUT1A
OUT1B
U1
OUT3B
RS1
OUT1A
SENSE1
OUT1B
VBB
A3989
PAD
OUT3A
SENSE3
OUT3B
VBB
RS3
CIN1
OUT2B
OUT3B
CIN2
OUT2B
CIN1
CIN2
RS2
SENSE2
OUT2A
NC
SENSE3
OUT3A
NC
OUT2A
RS2
CVDD1
OUT3A
VDD
CVDD2
GND
CVDD1
CVDD2
Figure 5. Printed circuit board layout with typical application circuit, shown at right. The copper area directly under the
A3989 (U1) is soldered to the exposed thermal pad on the underside of the device. The thermal vias serve also as electrical
vias, connecting it to the ground plane on the other side of the PCB , so the two copper areas together form the star ground.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
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