参数资料
| 型号： | 73S8009CN-DB |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 19/30页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO FOR 73S8009CN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
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DS_8009CN_026
73S8009CN Data Sheet
3.6
Activation and De-activation Sequence
The host controller is fully responsible for the activation sequencing of the smart card signals CLK, RST,
I/O, AUX1 and AUX2. All these signals are held low by the 73S8009CN when the card is in the de-
activated state. Upon card activation (the fall of CMDVCC ( #/% )), all the signals are held low by the
73S8009CN until RDY goes high. The host should set the signals RSTIN, I/OUC, CLKIN, AUX1UC and
AUX2UC low prior to activating the card and allow RDY to go high before transitioning any of these
signals. In order to initiate activation, the card must be present and OFF must be high.
At t1 (500us), if RDY=0 or overcurrent, circuit will de-activate (safety feature)
CMDVCC5 or CMDVCC3
VCC
I/OUC
I/O
RDY
RSTIN
RST
CLKIN
Ignored
Ignored
Ignored
t1
VCC valid
I/O = I/OUC if RDY=1
RST = RSTIN if RDY=1
CLK
CLK=CLKIN if RDY=1
I/O, AUX1, AUX2, CLK, RST are held LOW until RDY = 1 and CMDVCCx = 0
Figure 5: Activation Sequence
Deactivation is initiated either by the system controller by setting both CMDVCC ( #/% ) high, or
automatically in the event of hardware faults or assertion of the OFF_ACK signal. Hardware faults are
over-current, under-voltage, and card extraction during the session. The host can manage the I/O
signals, CLKIN, RSTIN, and CMDVCC ( #/% ) to create other de-activation sequences for non-emergency
situations.
The following steps show the deactivation sequence and the timing of the card control signals when the
system controller sets the CMDVCC(x)B high:
1.
2.
3.
4.
RST goes low at the end of time t1.
De-assert CLK at the end of time t2.
I/O goes low at the end of time t3. Exit reception mode.
De-assert internal VCC_ON at the end of time t4. After a delay, VCC is de-asserted.
Note: Since the 73S8009CN does not control the waveshape of CLK (it is determined by the input form
the host CLKIN), there is no guarantee that the duty cycle of the last CLK high pulse will conform to duty
cycle requirements during an emergency deactivation.
Rev. 1.4
19
相关PDF资料 |
PDF描述 |
|---|---|
| 73S8009R-DB | BOARD DEMO 73S8009R 28-SOIC |
| 73S8014RT-DB | BOARD DEMO 73S8010RT 20-SOIC |
| 74-1/4"X72YD | TAPE ELECTRICAL POLY 1/4" YEL |
| 74032-103LF | USB A TYPE PLUG KIT LF |
| 74056-0010BLF | UNIV SERIAL BUS T/H LF |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8009R | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Low Cost Versatile Smart Card Interface |
| 73S8009R-DB | 功能描述:界面开发工具 73S8009R Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8009R-IL/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009R-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009R-IM/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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