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| 型号： | 440GX |
| 厂商： | Applied Micro Circuits Corp. |
| 英文描述： | Power PC 440GX Embedded Processor |
| 中文描述： | 超出了Power PC嵌入式处理器 |
| 文件页数： | 60/93页 |
| 文件大小： | 794K |
| 代理商： | 440GX |
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440GX – Power PC 440GX Embedded Processor
AMCC
63
Revision 1.15 – August 30, 2007
Data Sheet
Test Conditions
Clock timing and switching characteristics are specified in accordance with operating
conditions shown in the table “Recommended DC Operating Conditions.” AC
specifications are characterized with VDD = 1.5V, TC = +85 °C and a 10pF test load as
shown in the figure to the right.
DC Power Supply Loads
Parameter
Symbol
Frequency (MHz)
Typical
Maximum
Unit
Notes
VDD active operating current
IDD
533
1.37
1.69
A
2
667
1.49
1.8
A
2
800
1.77
2.2
A
2, 3
OVDD active operating current
IODD
533
58
111
mA
2
667
58
111
mA
2
800
58
111
mA
2, 3
SVDD active operating current
ISDD
533
544
749
mA
2
667
568
837
mA
2
800
680
940
mA
2, 3
AxVDD input current
IADD
33
mA
1, 2
Notes:
1. See “Absolute Maximum Ratings” on page 58 for filter recommendations.
2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors
including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,
and the power supply voltages. Your specific application can produce significantly different results. VDD (logic) current and power are
primarily dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD (I/O)
current and power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses. The following
information provides details about the conditions under which the listed values were obtained:
a. In general, the values are measured using a PPC440GX Evaluation Board set for Ethernet mode 4, PCI-X running at 100MHz with
an Intel Pro 1000, an Agilent Test card, an EBMI test card, a UART wrap plug, and one 128MB Micron DIMM while running
applications designed to maximize CPU power consumption. An external PCI master heavily loads the PCI bus with transfers
targeting SDRAM, while the internal DMA controller further increases SDRAM bus traffic.
System clock rates are set as follows: SysClk = 33MHz, CPU = 667MHz, PLB = 167MHz, and OPB = EBC = 83MHz.
b. Typical current is characterized at VDD = +1.5V, OVDD = +3.3V, SVDD = +2.5V, and TC = +47°C.
c. Maximum current is characterized at VDD = +1.6V, OVDD = +3.6V, SVDD = +2.7V, and TC = +85°C.
3. Estimated values.
Output
Pin
10pF
C
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相关代理商/技术参数 |
参数描述 |
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| 440HA002M1507-N | 功能描述:环形MIL规格后盖 RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440HA002N2312-C | 功能描述:环形MIL规格后盖 RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440HA002NF0902-N | 功能描述:环形MIL规格后盖 RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440HA002NF0903-N | 功能描述:环形MIL规格后盖 RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
| 440HA002NF1102-N | 功能描述:环形MIL规格后盖 RoHS:否 制造商:Amphenol PCD MIL 类型:MIL-DTL-38999 III, IV 系列:AS85049 产品类型:Environmental EMI/RFI Backshells 外壳类型:Straight 外壳大小:18 外壳材质:Aluminum Alloy |
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