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参数资料
| 型号： | 33117 |
| 厂商： | Capital Advanced Technologies |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | PROTO-BOARD ADAPTER FOR 7-PIN D2 |
| 产品目录绘图： | 33117 Side 33117 Footprint |
| 标准包装： | 1 |
| 系列： | Surfboards® |
| 原型板类型： | SMD至SIP引脚 |
| Package Accepted： | 7 形引线 DD |
| 尺寸/尺寸： | 0.70" x 0.80"（17.8mm x 20.3mm） |
| 位置数： | 7 |
| 板厚度： | 0.031"（0.79mm）1/32" |
| 其它名称： | 33117CA |
SURFBOARDS
R
THE BREADBOARDING MEDIUM FOR
SURFACE MOUNT
TM
33000 SERIES APPLICATION SPECIFIC ADAPTERS
IDS33117
REV 1-2012
MODEL
33117
B
ACCEPTS
THESE
DEVICES
PARTIAL
LISTING
TO-263 7 LEAD
7- LEAD DD PKG.
MICREL SPAK-07L
ON SEMI D2PAK 7 LEAD
ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT
DEVICE FOOTPRINT
PINS ON .1 in. CENTERS
PROVIDE COMPATIBILITY
WITH BREADBOARDS AND
SOCKETS.
A
D
H
GND PAD .420 in.(10.66 mm) W
.375 in.(9.52 mm) H
F
USE FOR PROTOTYPING,
DEVICE EVALUATION OR
TEST, SMD TO THROUGH
HOLE CONVERSION.
NOTE: CIRCUIT FOILS AND
OUTPUT PINS MAY NOT BE
SUITABLE FOR OPERATION
AT HIGHER RATED DEVICE
CURRENTS. EXTREME
E
SINGLE-IN-LINE
G
TEMPERATURE RISE MAY
CAUSE FAILURE.
( SIP ) PINS ON .1 in
CENTERS. SEE PIN
PIN SPECIFICATIONS / TOLERANCES
C
SPECIFICATIONS
In Inches
A = .062 +- .006
FIG.
A
B
INCHES
.800
.700
MM
20.32
17.78
NOTE:
BOARD HEIGHT +- .5mm .020in.
BOARD WIDTH +- . 5mm .020in .
B = .130 +- .010
C =.100 +- .005
D = .020 +- .004
E = .031 +-.005
C
.100
2.54
SIP PIN SPACE +- .20mm .008in.
BOARD
SPECIFICATIONS
D
.625
15.87
PAD ( DEVICE) MAX
BOARD MATERIAL : .8mm, +-.13mm .031in+-..005 in.
E
F
G
H
.050
.100
.035
.150
1.27
2.54
.889
3.81
DEVICE LEAD PITCH
PAD LENGTH
PAD WIDTH
GAP
RoHS
Compliant
EC 2002/95
Thick G-10 FR-4 Glass Epoxy or equivalent.
CIRCUITS : 1 oz. Copper with RoHS compliant Lead
Free solder coating. Patten Position on board +-
.5mm .020in.
TOLERANCES: If not noted are +- 20%. Nominal values are given.
Controlling unit is Millimeters. Values rounded to nearest decimal. Slight
Variations due to manufacturing process can occur.
Copyright 1997-2012 by Capital Advanced Technologies, Inc. All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, and the
Leaf Circuit Logo are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All
information given is believed to be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for
a given purpose. No inducement is intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others.
CAPITAL ADVANCED TECHNOLOGIES, INC.
CAROL STREAM, ILLINOIS. USA.
PHONE 630-690-1696
WWW.CapitalAdvanced.Com
FAX 630-690-2498
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 331171302030 | 功能描述:EMI 垫圈与接地垫 WE-SECF SMD EMI Contact Finger Stock RoHS:否 制造商:Gore 长度:8 mm 宽度:2.5 mm 厚度:2.4 mm 产品类型:Pads |
| 331171302035 | 功能描述:EMI 垫圈与接地垫 WE-SECF SMD EMI Contact Finger Stock RoHS:否 制造商:Gore 长度:8 mm 宽度:2.5 mm 厚度:2.4 mm 产品类型:Pads |
| 3311720-59 | 制造商:LOCKHD 功能描述: |
| 33-1173 | 制造商:GC Electronics 功能描述:Conn BNC M Solder ST Cable Mount |
| 3-31173-3 | 功能描述:端子 BUDG R 22-16COMM 22-18MIL 5/16 RoHS:否 制造商:AVX 产品:Junction Box - Wire to Wire 系列:9826 线规:26-18 接线柱/接头大小: 绝缘: 颜色:Red 型式:Female 触点电镀:Tin over Nickel 触点材料:Beryllium Copper, Phosphor Bronze 端接类型:Crimp |
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