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参数资料
| 型号： | 33143 |
| 厂商： | Capital Advanced Technologies |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | PROTO-BOARD ADAPTER FOR SOT-143 |
| 产品目录绘图： | 33143 Side 33143 Footprint |
| 标准包装： | 1 |
| 系列： | Surfboards® |
| 原型板类型： | SMD至SIP引脚 |
| Package Accepted： | SOT-143 |
| 尺寸/尺寸： | 0.40" x 0.40"（10.2mm x 10.2mm） |
| 位置数： | 4 |
| 板厚度： | 0.031"（0.79mm）1/32" |
| 其它名称： | 33143CA |
SURFBOARDS
R
THE BREADBOARDING MEDIUM FOR
SURFACE MOUNT
TM
33000 SERIES APPLICATION SPECIFIC ADAPTERS
IDS33143
REV 1-2012
MODEL
33143
ACCEPTS
THESE
DEVICES
PARTIAL
LISTING
SOT-143
TO-253 AA
B
A
E
4 LEAD
DEVICE
FOOTPRINT
I
D
G
ANALOG RA-4 PKG.
LINEAR S4 PKG.
ON SEMI CASE 572AF-01
PANASONIC Mini 4 PKG.
ROHM SMD4 PKG.
TOSHIBA SMQ PKG.
ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT
FOR PROTOTYPING, DEVICE
EVALUATION OR TEST, SURFACE
MOUNT TO THROUGH HOLE
F
H
Pad
.050in.
(1.27mm) H
.060 in.
(1.52mm) W
CONVERSION.
PINS ON .100 in. CENTERS
PROVIDE COMPATIBILITY WITH
BREADBOARDS AND SOCKETS
SINGLE-IN-LINE
( SIP ) PINS ON .1 in
C
CENTERS.
SEE PIN SPECS.
PIN SPECIFICATIONS / TOLERANCES
In Inches
A = .062 +- .006
FIG.
A
B
C
D
INCHES
.400
.400
.100
.100
MM
10.16
10.16
2.54
2.54
NOTE:
BOARD HEIGHT +- .5mm .020in.
BOARD WIDTH +- . 5mm .020in .
SIP PIN SPACE +- .20mm .008in.
PAD CENTERLINE
B = .130 +- .010
C =.100 +- .005
D = .020 +- .004
E = .031 +-.005
E
.078
1.99
DEVICE LEAD PITCH
BOARD
SPECIFICATIONS
F
G
H
I
.060
.030
.070
.130
1.52
.762
1.77
3.30
PAD LENGTH
PAD WIDTH
GAP
MAX PIN WIDTH
RoHS
Compliant
EC 2002/95
BOARD MATERIAL : .8mm, +-.13mm .031in+-..005 in.
Thick G-10 FR-4 Glass Epoxy or equivalent.
CIRCUITS : 1 oz. Copper with RoHS compliant Lead
Free solder coating. Patten Position on board +-
.5mm .020in.
TOLERANCES: If not noted are +- 20%. Nominal values are given.
Controlling unit is Millimeters. Values rounded to nearest decimal. Slight
Variations due to manufacturing process can occur.
Copyright 1997-2012 by Capital Advanced Technologies, Inc. All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, and the
Leaf Circuit Logo are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All
information given is believed to be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for
a given purpose. No inducement is intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others.
CAPITAL ADVANCED TECHNOLOGIES, INC.
CAROL STREAM, ILLINOIS . USA.
PHONE 630-690-1696
WWW.CapitalAdvanced.Com
FAX 630-690-2498
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