参数资料
| 型号： | XRT75R03IVTR |
| 厂商： | Exar Corporation |
| 文件页数： | 40/92页 |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| 标准包装： | 750 |
| 类型： | 线路接口装置（LIU） |
| 驱动器/接收器数： | 3/3 |
| 规程： | DS3，E3，STS-1 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 128-LQFP |
| 供应商设备封装： | 128-LQFP（14x20） |
| 包装： | 带卷 (TR) |
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XRT75R03
THREE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR
REV. 1.0.8
42
NOTES:
1.
When Dual-Rail data format is selected, the B3ZS/HDB3 Encoder is automatically disabled.
2.
In Single-Rail format, the Bipolar Violations in the incoming data stream is converted to valid data pulses.
3.
Encoder and Decoder is enabled only in Single-Rail mode.
5.3
TRANSMIT PULSE SHAPER:
The Transmit Pulse Shaper converts the B3ZS encoded digital pulses into a single analog Alternate Mark
Inversion (AMI) pulse that meet the industry standard mask template requirements for STS-1 and DS3. See
Figures 8 and 9.
For E3 mode, the pulse shaper converts the HDB3 encoded pulses into a single full amplitude square shaped
pulse with very little slope. This is illustrated in Figure 7.
The Pulse Shaper Block also includes a Transmit Build Out Circuit, which can either be disabled or enabled by
setting the TxLEV_n input pin “High” or “Low” (in Hardware Mode) or setting the TxLEV_n bit to “1” or “0” in the
control register (in Host Mode).
For DS3/STS-1 rates, the Transmit Build Out Circuit is used to shape the transmit waveform that ensures that
transmit pulse template requirements are met at the Cross-Connect system. The distance between the
transmitter output and the Cross-Connect system can be between 0 to 450 feet.
For E3 rate, since the output pulse template is measured at the secondary of the transformer and since there is
no Cross-Connect system pulse template requirements, the Transmit Build Out Circuit is always disabled.
5.3.1
Guidelines for using Transmit Build Out Circuit:
If the distance between the transmitter and the DSX3 or STSX-1, Cross-Connect system, is less than 225 feet,
enable the Transmit Build Out Circuit by setting the TxLEV_n input pin “Low” (in Hardware Mode) or setting the
TxLEV_n control bit to “0” (in Host Mode).
If the distance between the transmitter and the DSX3 or STSX-1 is greater than 225 feet, disable the Transmit
Build Out Circuit.
5.3.2
Interfacing to the line:
The differential line driver increases the transmit waveform to appropriate level and drives into the 75
load as
shown in Figure 6.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XRT75R03IVTR-F | 功能描述:时钟合成器/抖动清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75R06 | 制造商:EXAR 制造商全称:EXAR 功能描述:SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR |
| XRT75R06D | 制造商:EXAR 制造商全称:EXAR 功能描述:SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER |
| XRT75R06DES | 功能描述:时钟合成器/抖动清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75R06DIB | 功能描述:网络控制器与处理器 IC 6CH E3/DS3/STS1 LIU w/DeSynch RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
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