参数资料
型号: W25Q64DWZEIG
厂商: Winbond Electronics
文件页数: 70/82页
文件大小: 0K
描述: IC FLASH SPI 64MBIT 8WSON
标准包装: 63
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WSON(8x6)
包装: 管件
W25Q64DW
11.4 DC Electrical Characteristics
PARAMETER
Input Capacitance
Output Capacitance
SYMBOL
C IN(1)
Cout (1)
CONDITIONS
V IN = 0V (1)
0V (1)
V OUT =
MIN
SPEC
TYP
MAX
6
8
UNIT
pF
pF
Input Leakage
I/O Leakage
I LI
I LO
±2
±2
μA
μA
Standby Current
Power-down Current
Current Read Data /
Dual /Quad 1MHz (2)
Current Read Data /
Dual /Quad 50MHz (2)
Current Read Data /
Dual /Quad 85MHz (2)
Current Read Data /
Dual Output Read/Quad
Output Read 104MHz (2)
Current Write Status
Register
Current Page Program
Current Sector/Block
Erase
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
I CC 1
I CC 2
I CC 3
I CC 3
I CC 3
I CC 3
I CC 4
I CC 5
I CC 6
I CC 7
V IL
V IH
V OL
V OH
/CS = VCC,
VIN = GND or VCC
/CS = VCC,
VIN = GND or VCC
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
/CS = VCC
/CS = VCC
/CS = VCC
/CS = VCC
I OL = 100 μA
I OH = –100 μA
–0.5
VCC x 0.7
VCC – 0.2
10
1
8
20
20
20
40
20
15
20
30
40
12
25
25
25
VCC x 0.3
VCC + 0.4
0.2
μA
μA
mA
mA
mA
mA
mA
mA
mA
mA
V
V
V
V
Notes:
1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 1.8V.
2. Checker Board Pattern.
- 70 -
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