参数资料
型号: W25Q64CVZEIG
厂商: Winbond Electronics
文件页数: 77/80页
文件大小: 0K
描述: IC SPI FLASH 64MBIT 8WSON
标准包装: 63
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 80MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WSON(8x6)
包装: 管件
其它名称: Q6830520 1
W25Q64CV
10. ORDERING INFORMATION
W (1) 25Q 64C V xx (2) I
W
25Q
64C
=
=
=
Winbond
SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
64M-bit
V =
2.7V to 3.6V
SS = 8-pin SOIC 208-mil; ST = 8-pin VSOP 208-mil; SF = 16-pin SOIC 300-mil;
ZP = 8-pad WSON 6x5mm; ZE = 8-pad WSON 8x6mm; DA = 8-pin PDIP 300-mil
TB = 5x5-1balls TFBGA 8x6mm; TC = 6x4-balls TFBGA 8x6mm
I
G
=
=
Industrial (-40°C to +85°C)
(3,4)
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb 2 O 3 )
Notes:
1. The “ W ” prefix is not included on the part marking.
2. Only the 2
nd
letter is used for the part marking; WSON package type ZP and ZE are not used for the part
marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please contact Winbond.
Publication Release Date: May 07, 2012
- 77 -
Revision F
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