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参数资料
| 型号： | UPC8211TK-EV15 |
| 厂商： | CEL |
| 文件页数： | 9/9页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD UPC8211TK 1.5GHZ |
| 标准包装： | 1 |
| 类型： | 放大器 |
| 适用于相关产品： | UPC8211TK@1.5GHz |
| 所含物品： | 板 |
μ PC8211TK
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to V CC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
S o l d e r i n g M e t h o d
S o l d e r i n g C o n d i t i o n s
C o n d i t i o n S y m b o l
Infrared Reflow
Peak temperature (package surface temperature)
T i m e a t p e a k t e m p e r a t u r e
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260 ° C or below
: 1 0 s e c o n d s o r l e s s
: 60 seconds or less
: 1 2 0 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260 ° C or below
T i m e a t p e a k t e m p e r a t u r e : 1 0 s e c o n d s o r l e s s
Preheating temperature (package surface temperature) : 120 ° C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10426EJ04V0DS
9
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