参数资料
型号: TLV2541EVM
厂商: Texas Instruments
文件页数: 18/32页
文件大小: 0K
描述: EVAL MOD FOR TLV2541
产品培训模块: Data Converter Basics
标准包装: 1
ADC 的数量: 1
位数: 12
采样率(每秒): 200k
数据接口: 串行
工作温度: 0°C ~ 70°C
已用 IC / 零件: TLV2541
已供物品:
相关产品: TLV2541IDRG4-ND - IC 12BIT 200 KSPS ADC S/O 8-SOIC
TLV2541IDR-ND - IC 12BIT 200 KSPS ADC S/O 8-SOIC
TLV2541IDGKRG4-ND - IC 12BIT 200 KSPS ADC S/O 8-MSOP
TLV2541IDGKR-ND - IC 12BIT 200 KSPS ADC S/O 8-MSOP
TLV2541IDGKG4-ND - IC 12BIT 200 KSPS ADC S/O 8-MSOP
TLV2541IDG4-ND - IC 12BIT 200 KSPS ADC S/O 8-SOIC
TLV2541CDGKRG4-ND - IC 12BIT 200 KSPS ADC S/O 8-MSOP
TLV2541CDGKR-ND - IC 12BIT 200 KSPS ADC S/O 8-MSOP
TLV2541CDGKG4-ND - IC 12BIT 200 KSPS ADC S/O 8-MSOP
296-2973-5-ND - IC 12BIT 200KPS SC S/O 8-MSOP
更多...
其它名称: 296-20577
TLV2541EVM-ND
PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Addendum-Page 3
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
相关PDF资料
PDF描述
GSM08DTBS-S189 CONN EDGECARD 16POS R/A .156 SLD
0210490232 CABLE JUMPER 1.25MM .305M 16POS
VI-20Z-EY CONVERTER MOD DC/DC 2V 20W
LLS2C222MELC CAP ALUM 2200UF 160V 20% SNAP
RMA06DRSI-S288 CONN EDGECARD 12POS .125 EXTEND
相关代理商/技术参数
参数描述
TLV2541ID 功能描述:模数转换器 - ADC 12bit SAR ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
TLV2541IDG4 功能描述:模数转换器 - ADC 12-Bit 200 kSPS Serial Out RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
TLV2541IDGK 功能描述:模数转换器 - ADC 12bit SAR ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
TLV2541IDGKG4 功能描述:模数转换器 - ADC 12-Bit 200 kSPS Serial Out RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
TLV2541IDGKR 功能描述:模数转换器 - ADC 12-Bit 200 kSPS Serial Out RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32