参数资料
| 型号： | THS4032CDR |
| 厂商： | Texas Instruments |
| 文件页数： | 24/47页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP VFB 100MHZ DUAL 8SOIC |
| 标准包装： | 2,500 |
| 放大器类型： | 电压反馈 |
| 电路数： | 2 |
| 转换速率： | 100 V/µs |
| -3db带宽： | 100MHz |
| 电流 - 输入偏压： | 3µA |
| 电压 - 输入偏移： | 500µV |
| 电流 - 电源： | 8.5mA |
| 电流 - 输出 / 通道： | 90mA |
| 电压 - 电源，单路/双路(±)： | 9 V ~ 32 V，±4.5 V ~ 16 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
| 配用： | 296-10031-ND - EVAL MOD FOR THS4032 |
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P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS403x IC (watts)
TMAX = Absolute maximum operating junction temperature (125°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
MAXIMUMPOWERDISSIPATION
AMBIENTTEMPERATURE
vs
0
0.5
1
1.5
2
2.5
3
-40
-20
0
20
40
60
80
100
TA-Free AirTemperature-°C
MaximumPowerDissipation-W
DGNPackage
=58.4C/W2oz.
TraceandCopperPad
WithSolder
q
JA
T =130C
J
DGNPackage
=158.4C/W2oz.
TraceandCopperPad
WithoutSolder
q
JA
SOICPackage
High-KTestPCB
=98C/W
q
JA
SOICPackage
High-KTestPCB
=166.7C/W
q
JA
SLOS224G – JULY 1999 – REVISED MARCH 2010
www.ti.com
The actual thermal performance achieved with the THS403xDGN in its PowerPAD package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches × 3 inches
(7,62 cm × 7,62 cm), then the expected thermal coefficient, qJA, is about 58.4°C/W. For comparison, the
non-PowerPAD version of the THS403x IC (SOIC) is shown. For a given qJA, the maximum power dissipation
is shown in Figure 62 and is calculated by the following formula:
(3)
Results are with no air flow and PCB size = 3”× 3” (7,62 cm x 7,62 cm)
Figure 62. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments technical brief, PowerPAD Thermally-Enhanced Package (SLMA002). This document
can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also
be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
The next thing to be considered is package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the device,
especially multiamplifier devices. Because these devices have linear output stages (Class A-B), most of the heat
dissipation is at low output voltages with high output currents. Figure 63 to Figure 66 shows this effect, along with
the quiescent heat, with an ambient air temperature of 50°C. When using VCC = ±5 V, heat is generally not a
problem, even with SOIC packages. But, when using VCC = ±15 V, the SOIC package is severely limited in the
amount of heat it can dissipate. The other key factor when looking at these graphs is how the devices are
mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But, the device should
30
Copyright 1999–2010, Texas Instruments Incorporated
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相关代理商/技术参数 |
参数描述 |
|---|---|
| THS4032CDRG4 | 功能描述:高速运算放大器 100-MHz Low Noise Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道数量:1 电压增益 dB:116 dB 输入补偿电压:0.5 mV 转换速度:55 V/us 工作电源电压:36 V 电源电流:7.5 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| THS4032D | 制造商:TI 制造商全称:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4032DGN | 制造商:TI 制造商全称:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4032-EP | 制造商:TI 制造商全称:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4032EVM | 功能描述:放大器 IC 开发工具 THS4032 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
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