参数资料
型号: SY89544UMG TR
厂商: Micrel Inc
文件页数: 4/10页
文件大小: 0K
描述: IC MUX 4:1 LVDS DIFF 2.5V 32-MLF
标准包装: 1,000
系列: SY89
类型: 多路复用器
电路: 1 x 4:1
独立电路: 1
电压电源: 单电源
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘,32-MLF?
供应商设备封装: 32-MLF?(5x5)
包装: 带卷 (TR)
其它名称: SY89544UMGTR
SY89544UMGTR-ND
3
Precision Edge
SY89544U
Micrel, Inc.
M9999-082407
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (V
CC) ................................. –0.5V to +4.0V
Input Voltage (V
IN) ........................................ –0.5V to VCC
Termination Current(3)
Source or sink current on V
T ..................................... ±100mA
Input Current
Source or sink current on IN, /IN .......................... ±50mA
Lead Temperature (soldering, 20 sec.) ................... +260°C
Storage Temperature (TS) ...................... –65°C to +150°C
Operating Ratings(2)
Supply Voltage (V
CC) .......................... +2.375V to +2.625V
Ambient Temperature (T
A) ........................ –40°C to +85°C
Package Thermal Resistance(4)
MLF JA)
Still-Air ................................................................ 35°C/W
500lfpm .............................................................. 28°C/W
MLF JB)
Junction-to-Board ............................................... 20°C/W
T
A = –40°C to +85°C; Unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Power Supply
2.375
2.5
2.625
V
I
CC
Power Supply Current
No load, Max. V
CC
(6)
50
70
mA
R
DIFF_IN
Differential Input Resistance
80
100
120
(IN-to-/IN)
R
IN
Input Resistance
40
50
60
(IN-to-V
T, /IN-to-VT)
V
IH
Input High Voltage
1.2
V
CC
V
(IN, /IN)
V
IL
Input Low Voltage
0
V
IH–0.1
V
(IN, /IN)
V
IN
Input Voltage Swing
Notes 7
0.1
V
CC
V
(IN, /IN)
V
DIFF_IN
Differential Input Voltage Swing
Notes 7
0.2
V
|IN – /IN|
IN-to-V
T
Voltage from Input to V
T
1.8
V
Notes:
1. Permanent device damage may occur if the ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and
functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute
maximum ratings conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ΨJB uses 4-layer
θJA in still-air unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. Includes current through internal 50 pull-ups.
7. See “Single-Ended and Differential Swings” section for VIN and VDIFF_IN definitions.
DC ELECTRICAL CHARACTERISTICS(5)
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