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参数资料
型号： S25FL004D0LNAI013
厂商： Spansion Inc.
英文描述： 4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface
中文描述： 4兆位的CMOS闪存3.0伏，50赫兹的SPI总线接口
文件页数： 23/36页
文件大小： 724K
代理商： S25FL004D0LNAI013
June 28, 2004 S25FL004D_00A0
S25FL Family (Serial Peripheral Interface) S25FL004D
3
Ad va nc e
In forma t i o n
Table of Contents
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . 5
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .6
Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . .7
SPI Modes ...................................................................................................7
Figure 1. Bus Master and Memory Devices on the SPI Bus ....... 8
Figure 2. SPI Modes Supported............................................ 8
Operating Features . . . . . . . . . . . . . . . . . . . . . . . . .9
Page Programming .................................................................................. 9
Sector Erase, or Bulk Erase ................................................................. 9
Polling During a Write, Program, or Erase Cycle ........................ 9
Status Register ......................................................................................... 9
Protection Modes ..................................................................................10
Table 1. Protected Area Sizes (S25FL004D). .........................10
Hold Condition Modes ........................................................................10
Figure 3. Hold Condition Activation...................................... 11
Memory Organization . . . . . . . . . . . . . . . . . . . . . . 12
Table 2. Sector Address Table – S25FL004D .........................12
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. Instruction Set. ....................................................13
Write Enable (WREN) .........................................................................14
Figure 4. Write Enable (WREN) Instruction Sequence............. 14
Write Disable (WRDI) ........................................................................14
Figure 5. Write Disable (WRDI) Instruction Sequence ............ 14
Read Status Register (RDSR) ............................................................. 15
Figure 6. Read Status Register (RDSR)
Instruction Sequence ........................................................ 15
Figure 7. Status Register Format......................................... 15
Write Status Register (WRSR) .......................................................... 16
Figure 8. Write Status Register (WRSR)
Instruction Sequence ........................................................ 17
Table 4. Protection Modes ..................................................17
Read Data Bytes (READ) ....................................................................18
Figure 9. Read Data Bytes (READ) Instruction Sequence ........ 18
Read Data Bytes at Higher Speed (FAST_READ) .......................18
Figure 10. Read Data Bytes at Higher Speed
(FAST_READ) Instruction Sequence..................................... 19
Page Program (PP) ................................................................................. 19
Figure 11. Page Program (PP) Instruction Sequence .............. 20
Sector Erase (SE) ..................................................................................20
Figure 12. Sector Erase (SE) Instruction Sequence ................ 21
Bulk Erase (BE) ....................................................................................... 21
Figure 13. Bulk Erase (BE) Instruction Sequence................... 22
Deep Power Down (DP) ....................................................................22
Figure 14. Deep Power Down (DP) Instruction Sequence ........ 23
Release from Deep Power Down (RES) ....................................... 23
Figure 15. Release from Deep Power Down I
nstruction Sequence.......................................................... 24
Release from Deep Power Down and Read Electronic
Signature (RES) ......................................................................................24
Figure 16. Release from Deep Power Down and Read Electronic
Signature (RES) Instruction Sequence ................................. 25
Power-up and Power-down . . . . . . . . . . . . . . . . . . 26
Figure 17. Power-Up Timing ............................................... 27
Figure 18. Power-Down and Voltage Drop ............................ 27
Table 5. Power-Up Timing ................................................. 28
Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . 28
Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 28
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 28
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 6. DC Characteristics ............................................... 29
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 19. AC Measurements I/O Waveform ......................... 30
Table 7. Test Specifications ............................................... 30
Table 8. AC Characteristics ................................................ 31
Figure 20. SPI Mode 0 (0,0) Input Timing............................. 32
Figure 21. SPI Mode 0 (0,0) Output Timing .......................... 32
Figure 22. HOLD# Timing .................................................. 33
Figure 23. Write Protect Setup and Hold Timing during WRSR when
SRWD=1 ......................................................................... 33
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 34
S08 wide—8-pin Plastic Small Outline 208mils Body Width
Package ................................................................................................... 34
8-Contact WSON (6mm x 5mm) Leadless Package .................35
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 36
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S25FL004D0LNFI011 制造商:SPANSION 制造商全称:SPANSION 功能描述:4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface
S25FL004D0LNFI013 制造商:SPANSION 制造商全称:SPANSION 功能描述:4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface
S25FL004K0XMFI010 功能描述:闪存 4-MBIT CMOS 3V FLASH MEMORY 104MHz SPI RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
S25FL004K0XMFI011 功能描述:闪存 4-MBIT CMOS 3V FLASH MEMORY 104MHz SPI RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
S25FL004K0XMFI013 制造商:Spansion 功能描述:FLASH SERL-SPI 3V/3.3V 4MBIT - Bulk
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