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| 型号： | PIXIE-SO-PXSR |
| 厂商： | Flexipanel |
| 文件页数： | 9/13页 |
| 文件大小： | 0K |
| 描述： | MODULE ZIGBEE SW ROUTER 26SMD |
| 标准包装： | 1 |
| 系列： | Pixie™ |
| 频率： | 2.4GHz |
| 调制或协议： | 802.15.4 Zigbee |
| 功率 - 输出： | 0dBm |
| 电源电压： | 2.1 V ~ 3.6 V |
| 电流 - 接收： | 25mA |
| 电流 - 传输： | 25mA |
| 数据接口： | PCB，表面贴装 |
| 存储容量： | 64kB ROM，3986B RAM |
| 天线连接器： | 板载，跟踪 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 26-SMD |
| 包装： | 管件 |
| 产品目录页面： | 560 (CN2011-ZH PDF) |
| 其它名称： | 658-1005-5 |
If soldering manually, use the following procedure:
1. Tin the contact pads on the module, trying to get
more or less the same amount of solder on each.
Work on a soft surface so that the components on
the topside are not damaged.
2. Tin contact pads on main board.
Pixie Lite
Pixie Lite is a reduced function device based on the
18LF2520 microprocessor. It has sufficient memory to
implement end devices only.
Bear the following points in mind when developing
applications with Pixie Lite:
3. Place the module in position on the main board.
4. Starting with the pads most likely to be in physical
contact, apply heat with a soldering iron to the
exposed part of the main board pads. Abut the iron
against the edge of the module so that the heat is
transmitted to the contact area of the pads. After
10-15 seconds, remove heat. Around 90% of pads
should be successfully soldered.
5. Test for continuity between the pad on the upper
side of the board and the protruding part of the pad
on the main board.
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Pin connections RE1 and RE2 are not present
and their pads should be omitted on the PCB
layout.
The firmware must be recompiled to suit an
18LF2520 target.
Flash table writes are 32 bytes instead of 64 so
the WRITE_BLOCK_SIZE value in zNVM.c must be
set to 32ul . (See Microchip DS80229B.)
A single-bank stack model is recommended.
ROM reduces from 64K to 32K.
RAM reduces from 3986 bytes to 1536.
6. Rework non-conducting contacts by applying heat
again and a little extra solder.
Location on main board
The module should be located so that the antenna abuts
the edge of the board or overhangs it. It should be
placed so that it is unlikely that interfering items such as
metal, water, cellphones, body tissue, etc, can come
See Appendix I for a suitable linker script for the
Microchip Stack for ZigBee running on the
PIC18LF2520.
Future releases of Pixie & Pixie Lite
The following changes are anticipated in future revisions
of Pixie and Pixie Lite.
into close proximity.
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The 18LF2520 on the Pixie Lite may be replaced
It is recommended that tracks and components are not
placed in PCB layers below the module. However, if
space limitations require it, leave the surface in contact
with the module uncoppered and place a grounded fill in
the layer immediately below. Any vias that might come
in contact with the module should be completely
covered with resist to avoid shorting to vias on the
module. The main board should contain as much
grounded copper fill as possible in order to reduce
circuit noise.
Enclosures
Metal enclosures are not recommended for attenuation
reasons. If one must be used, aim to put as many holes
in it as possible at least 3cm long.
For mains isolation and intrinsic safety applications,
potting in a shallow layer of clear potting compound is
recommended. A 5mm layer of potting compound (RS
Components p/n 199-1468) has been measured to
attenuate the signal by approximately 3dB. LEDs can
be clearly seen through the potting compound and bind
switches, etc, can be implemented using reed switches.
For all-weather and external mounting applications,
contact us for a range of puck antenna enclosures.
by an 18LF2620 if new features in the ZigBee
stack, such as security, require the extra memory.
Bibliography
ZigBee for Applications Developers , white paper
downloadable from www.flexipanel.com .
ZigBee Specification , downloadable from
www.zigbee.org .
EasyBee Data Sheet , downloadable from
www.flexipanel.com .
PICDEM Z User Guide , downloadable from
www.microchip.com .
AN965 Microchip Stack for the ZigBee Protocol ,
application note, downloadable from
www.microchip.com .
Microchip Stack for ZigBee Protocol , supplementary
notes included with the Microchip Stack for ZigBee
firmware downloadable from www.microchip.com .
PIC18F4620 Data Sheet , downloadable from
www.microchip.com .
p9
17-Mar-08
Pixie DS481-17
? FlexiPanel Ltd
Patents may apply and/or pending
www.FlexiPanel.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PIXLITE-DIL-PLFE | 功能描述:MODULE ZIGBEE SW FAST 24-DIP RoHS:是 类别:RF/IF 和 RFID >> RF 收发器 系列:Pixie™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:30 系列:- 频率:4.9GHz ~ 5.9GHz 数据传输率 - 最大:54Mbps 调制或协议:* 应用:* 功率 - 输出:-3dBm 灵敏度:- 电源电压:2.7 V ~ 3.6 V 电流 - 接收:* 电流 - 传输:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 工作温度:-25°C ~ 85°C 封装/外壳:68-TQFN 裸露焊盘 包装:管件 |
| PIXLITE-DIL-PLSE | 功能描述:MODULE ZIGBEE SW SLEEPY 24DIP RoHS:是 类别:RF/IF 和 RFID >> RF 收发器 系列:Pixie™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:30 系列:- 频率:4.9GHz ~ 5.9GHz 数据传输率 - 最大:54Mbps 调制或协议:* 应用:* 功率 - 输出:-3dBm 灵敏度:- 电源电压:2.7 V ~ 3.6 V 电流 - 接收:* 电流 - 传输:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 工作温度:-25°C ~ 85°C 封装/外壳:68-TQFN 裸露焊盘 包装:管件 |
| PIXLITE-SO-PLFE | 功能描述:Zigbee/802.15.4模块 Pixie Zigbee Mod SO Fast End Device FW RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| PIXLITE-SO-PLSE | 功能描述:Zigbee/802.15.4模块 Pixie Zigbee Mod SO Sleepy End Device FW RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| PIXZEELITE | 制造商:RF Solutions LTD 功能描述:MODULE MINI ZIGBEE IEEE 802.15.4 |
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