参数资料
型号: MII200-12A4
厂商: IXYS
文件页数: 4/4页
文件大小: 0K
描述: MOD IGBT RBSOA 1200V 270A Y3-DCB
标准包装: 2
IGBT 类型: NPT
配置: 半桥
电压 - 集电极发射极击穿(最大): 1200V
Vge, Ic时的最大Vce(开): 2.7V @ 15V,150A
电流 - 集电极 (Ic)(最大): 270A
电流 - 集电极截止(最大): 10mA
Vce 时的输入电容 (Cies): 11nF @ 25V
功率 - 最大: 1130W
输入: 标准
NTC 热敏电阻:
安装类型: 底座安装
封装/外壳: Y3-DCB
供应商设备封装: Y3-DCB
MII 200-12 A4
MID 200-12 A4
MDI 200-12 A4
90
120
80
800
E on
mJ
60
t d(on)
t r
ns
80
t
mJ
E off 60
t d(off)
ns
600
t
30
0
E on
V CE = 600V
V GE = ±15V
R G = 6.8
T J = 125 ° C
40
0
40
20
0
E off
V CE = 600V
V GE = ±15V
R G = 6.8
T J = 125 ° C
t f
400
200
0
0
100
200
300 A
0
100
200
300 A
I C
Fig. 7 Typ. turn on energy and switching
times versus collector current
I C
Fig. 8 Typ. turn off energy and switching
times versus collector current
E on
50
mJ
40
V CE = 600V
V GE = ±15V
I C = 150A
T J = 125 ° C
t d(on)
E on
200
ns
160
t
E off
50
mJ
40
V CE = 600V
V GE = ±15V
I C = 150A
T J = 125 ° C
t d(off)
2000
ns
1600
t
30
120
30
E off
1200
20
10
t r
80
40
20
10
800
400
0
0
0
t f
0
0
4
8
12
16
20
24
28
0
4
8
12
16
20
24
28
400
A
R G
Fig. 9 Typ. turn on energy and switching
times versus gate resistor
1
K/W
R G
Fig.10 Typ. turn off energy and switching
times versus gate resistor
I CM 300
R G = 6.8
0.1
Z thJC
0.01
diode
IGBT
200
T J = 125 ° C
V CEK < V CES
0.001
100
0
0.0001
0.00001
single pulse
200-12
0
200
400
600
800 1000 1200 V
0.00001 0.0001
0.001
0.01
0.1
s
1
V CE
Fig. 11 Reverse biased safe operating area
RBSOA
? 2000 IXYS All rights reserved
t
Fig. 12 Typ. transient thermal impedance
4-4
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