参数资料
型号: MIC22600YTSE
厂商: Micrel Inc
文件页数: 18/32页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 6A 24TSSOP
标准包装: 62
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 可调至 0.7V
输入电压: 2.6 V ~ 5.5 V
PWM 型: 电压模式
频率 - 开关: 1MHz
电流 - 输出: 6A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm)裸露焊盘
包装: 管件
供应商设备封装: 24-EPAD-TSSOP
其它名称: MIC22600YTSE-ND
Micrel, Inc.
Current Limit
Where
MIC22600
The MIC22600 is protected against overload in two
stages. The first is to limit the current in the P-channel
switch; the second is by over temperature shutdown.
Current is limited by measuring the current through the
high-side MOSFET during its power stroke and
immediately switching off the driver when the preset limit
is exceeded.
The circuit in Figure 4 describes the operation of the
current-limit circuit. Since the actual RDS ON of the P-
Channel MOSFET varies part-to-part, over temperature
and with input voltage, simple IR voltage detection is not
employed. Instead, a smaller copy of the Power
MOSFET (Reference FET) is fed with a constant current
which is a directly proportional to the factory set current
limit. This sets the current limit as a current ratio and
?
?
?
P DISS is the power dissipated within the MLF ?
package and is typically 1.5W at 6A load. This
has been calculated for a 1μH inductor and
details can be found in Table 1 below for
reference.
R θ JA is a combination of junction to case thermal
resistance (R θ JC ) and Case-to-Ambient thermal
resistance (R θ CA ), since thermal resistance of
the solder connection from the ePAD to the PCB
is negligible; R θ CA is the thermal resistance of
the ground plane to ambient, so R θ JA = R θ JC +
R θ CA .
T AMB is the Operating Ambient temperature.
thus, is not dependant upon the RDS ON value. ? Current
limit is set to 9A nominal. Variations in the scale factor K
between the Power PFET and the reference PFET used
to generate the limit threshold account for a relatively
small inaccuracy.
Figure 13. Current-Limit Detail
Thermal Considerations
Example:
The Evaluation board has two copper planes
contributing to an R θ JA of approximately 25°C/W. The
worst case R θ JC of the MLF 4x4 is 14 o C/W.
R θ JA = R θ JC + R θ CA
R θ JA = 14 + 25 = 39 o C/W
To calculate the junction temperature for a 50°C
ambient:
T J = T AMB +P DISS . R θ JA
T J = 50 + (1.5 x 39)
T J = 109°C
This is below the maximum of 125°C.
The MIC22600 is packaged in the MLF ? 4mm x 4mm, a
package that has excellent thermal performance
equaling that of the larger TSSOP packages. This
maximizes heat transfer from the junction to the exposed
pad (ePad) which connects to the ground plane. The
size of the ground plane attached to the exposed pad
determines the overall thermal resistance from the
junction to the ambient air surrounding the printed circuit
board. The junction temperature for a given ambient
V OUT
@6A
1
1.2
1.8
2.5
3.3
3
1.47
1.45
1.46
1.61
3.5
1.50
1.47
1.45
1.53
1.70
V IN
4
1.52
1.49
1.45
1.49
1.62
4.5
1.54
1.51
1.47
1.47
1.56
5
1.56
1.54
1.48
1.47
1.53
temperature can be calculated using:
T J = T AMB + P DISS · R θ JA
Table 2. Power Dissipation (W) for 6A Output
June 2011
18
M9999-062411-D
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