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参数资料
| 型号： | MAX17035ETG+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 27/28页 |
| 文件大小： | 0K |
| 描述： | IC SMBUS BATT CHRGR HF 24TQFN |
| 标准包装： | 75 |
| 功能： | 充电管理 |
| 电池化学： | 多化学 |
| 电源电压： | 8 V ~ 26 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 管件 |
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High-Frequency,
Low-Cost SMBus Chargers
Ideally, surface-mount power components are flush
against one another with their ground terminals
almost touching. These high-current grounds are then
connected to each other with a wide, filled zone of
top-layer copper, so they do not go through vias. The
resulting top-layer subground plane is connected to
the normal inner-layer ground plane at the paddle.
Other high-current paths should also be minimized,
but focusing primarily on short ground and current-
sense connections eliminates about 90% of all PCB
layout problems.
2) Place the IC and signal components. Keep the
main switching node (LX node) away from sensitive
analog components (current-sense traces and V AA
capacitor). Important: The IC must be no further
than 10mm from the current-sense resistors. Quiet
connections to V AA , CC, ACIN, and DCIN should
be returned to a separate ground (GND) island. The
appropriate traces are marked on the schematic with
the () ground symbol. There is very little current flowing
in these traces, so the ground island need not be
Chip Information
PROCESS: BiCMOS
very large. When placed on an inner layer, a sizable
ground island can help simplify the layout because
the low current connections can be made through
vias. The ground pad on the backside of the package
should also be connected to this quiet ground island.
3) Keep the gate drive traces (DHI and DLO) as short
as possible (L < 20mm), and route them away from
the current-sense lines and REF. These traces should
also be relatively wide (W > 1.25mm).
4) Place ceramic bypass capacitors close to the IC. The
bulk capacitors can be placed further away. Place the
current-sense input filter capacitors under the part,
connected directly to the GND pin.
5) Use a single-point star ground placed directly below
the part at the PGND pin. Connect the power ground
(ground plane) and the quiet ground island at this
location.
Refer to the MAX17435 and MAX17535 Evaluation Kit
layouts for a layout example.
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages . Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status .
PACKAGE
TYPE
24 TQFN-EP
PACKAGE
CODE
T2444+3
OUTLINE
NO.
LAND
PATTERN NO.
______________________________________________________________________________________
27
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX17035ETG+ | 功能描述:电池管理 High Freq SMBus Battery Charger RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX17035ETG+T | 功能描述:电池管理 High Freq SMBus Battery Charger RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX17035EVKIT+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX17036GTL+ | 功能描述:电压模式 PWM 控制器 1/2/3-Phase PWM IMVP-6.5 VID Ctlr RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| MAX17036GTL+T | 功能描述:电压模式 PWM 控制器 1/2/3-Phase PWM IMVP-6.5 VID Ctlr RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
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