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参数资料
| 型号： | MAX17006ETP+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 21/24页 |
| 文件大小： | 0K |
| 描述： | IC MULTI-CHEM BATT CHRGR 20-TQFN |
| 标准包装： | 75 |
| 功能： | 充电管理 |
| 电池化学： | 多化学 |
| 电源电压： | 8 V ~ 26 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-WFQFN 裸露焊盘 |
| 供应商设备封装： | 20-TQFN-EP（4x4） |
| 包装： | 管件 |
1.2MHz Low-Cost,
High-Performance Chargers
c) Minimize other trace lengths in the high-current
paths.
d) Use > 5mm wide traces in the high-current
paths.
e) Connect C IN to high-side MOSFET (10mm max
length).
f) Minimize the LX node (MOSFETs, rectifier cath-
ode, inductor (15mm max length)). Keep LX on
one side of the PCB to reduce EMI radiation.
Ideally, surface-mount power components are flush
against one another with their ground terminals
almost touching. These high-current grounds are
then connected to each other with a wide, filled
zone of top-layer copper, so they do not go through
vias. The resulting top-layer subground plane is
connected to the normal inner-layer ground plane
at the paddle. Other high-current paths should also
be minimized, but focusing primarily on short
ground and current-sense connections eliminates
about 90% of all PCB layout problems.
2) Place the IC and signal components. Keep the
main switching node (LX node) away from sensitive
analog components (current-sense traces and V AA
capacitor). Important: the IC must be no further than
10mm from the current-sense resistors. Quiet con-
nections to V AA and CC should be returned to a sep-
arate ground (GND) island. There is very little current
flowing in these traces, so the ground island need not
be very large. When placed on an inner layer, a siz-
able ground island can help simplify the layout
because the low-current connections can be made
through vias. The ground pad on the backside of the
package should also be connected to this quiet
ground island.
3) Keep the gate drive traces (DHI and DLO) as short
as possible (L < 20mm), and route them away from
the current-sense lines and V AA . These traces
should also be relatively wide (W > 1.25mm).
4) Place ceramic bypass capacitors close to the IC.
The bulk capacitors can be placed further away.
Place the current-sense input filter capacitors under
the part, connected directly to the GND pin.
5) Use a single-point star ground placed directly
below the part at the PGND pin. Connect the power
ground (ground plane) and the quiet ground island
at this location.
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21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX17006ETP+ | 功能描述:电池管理 1.2MHz High-Perf Charger RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX17006ETP+T | 功能描述:电池管理 1.2MHz High-Perf Charger RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX17006EVKIT+ | 功能描述:电池管理 1.2MHz Low-Cost High-Performance Chargers RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX17007AGTI+ | 功能描述:电压模式 PWM 控制器 QPWM Graphics Core Controller RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| MAX17007AGTI+T | 功能描述:电压模式 PWM 控制器 QPWM Graphics Core Controller RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
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