参数资料
型号: LTC2309IF#PBF
厂商: Linear Technology
文件页数: 24/26页
文件大小: 0K
描述: IC ADC 12BIT SAR 20-TSSOP
标准包装: 74
位数: 12
采样率(每秒): 14k
数据接口: I²C,串行
转换器数目: 1
功率耗散(最大): 15mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 20-TSSOP
包装: 管件
输入数目和类型: 8 个单端,单极;8 个单端,双极;4 个差分,单极;4 个差分,双极
配用: DC1337A-ND - BOARD SAR ADC LTC2309
LTC2309
2309fd
pIn FunCtIOns
CH3-CH7 (Pins 1-5):Channel3toChannel7Analog
Inputs.CH3-CH7canbeconfiguredassingle-ended
or differential input channels. See the Analog Input
Multiplexersection.
COM (Pin 6): Common Input. This is the reference
point for all single-ended inputs. It must be free of
noiseandshouldbeconnectedtogroundforunipolar
conversionsandmidwaybetweenGNDandREFCOMP
forbipolarconversions.
VREF (Pin 7):2.5VReferenceOutput.BypasstoGND
withaminimum2.2Fceramiccapacitor.Theinternal
referencemaybeoverdrivenbyanexternal2.5Vrefer-
enceatthispin.
REFCOMP (Pin 8):ReferenceBufferOutput.Bypass
to GND with 10F and 0.1F ceramic capacitors in
parallel.Nominaloutputvoltageis4.096V.Theinternal
referencebufferdrivingthispinisdisabledbyground-
ingVREF,allowingREFCOMPtobeoverdrivenbyan
externalsource.
GND (Pins 9-11, 18-20):Ground.AllGNDpinsmust
beconnectedtoasolidgroundplane.
VDD (Pins 12, 13, 21):5VSupply.TherangeofVDDis
4.75Vto5.25V.BypassVDDtoGNDwitha10Fceramic
capacitorinparallelwiththree0.1Fceramiccapacitors,
onelocatedascloseaspossibletoeachpin.
AD0 (Pin 14):ChipAddressControlPin.Thispinis
configuredasathree-state(LOW,HIGH,floating)ad-
dresscontrolbitforthedeviceI2Caddress.SeeTable2
foraddressselection.
AD1 (Pin 15):ChipAddressControlPin.Thispinis
configured as a three-state (LOW, HIGH, floating)
address control bit for the device I2C address. See
Table2foraddressselection.
SCL (Pin 16):SerialClockPinoftheI2CInterface.The
LTC2309canonlyactasaslaveandtheSCLpinonly
acceptsanexternalserialclock.Dataisshiftedinto
theSDApinontherisingedgesoftheSCLclockand
outputthroughtheSDApinonthefallingedgesofthe
SCLclock.
SDA (Pin 17):BidirectionalSerialDataLineoftheI2C
Interface.Intransmittermode(read),theconversion
resultisoutputattheSDApin,whileinreceivermode
(write),theDINwordisinputattheSDApintocon-
figuretheADC.Thepinishighimpedanceduringthe
datainputmodeandisanopen-drainoutput(requires
anappropriatepull-updevicetoVDD)duringthedata
outputmode.
CH0-CH2 (Pins 22-24):Channel0toChannel2Analog
Inputs.CH0-CH2canbeconfiguredassingle-ended
or differential input channels. See the Analog Input
Multiplexersection.
Exposed Pad (Pin 25): Ground. Must be soldered
directlytogroundplane.
(QFN)
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