参数资料
型号: LT3990HMSE#PBF
厂商: Linear Technology
文件页数: 19/22页
文件大小: 0K
描述: IC REG BUCK ADJ 0.35A 16MSOP
标准包装: 37
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 1.21 V ~ 25 V
输入电压: 4.2 V ~ 62 V
PWM 型: 电流模式,Burst Mode?
频率 - 开关: 210kHz ~ 2.3MHz
电流 - 输出: 350mA
同步整流器:
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 16-TFSOP(0.118",3.00mm 宽)裸露焊盘
包装: 管件
供应商设备封装: 16-MSOP,裸露焊盘

LT3990/LT3990-3.3/LT3990-5
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
0.70 ± 0.05
3.55 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.125
TYP
6
10
0.40 ± 0.10
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
1.65 ± 0.10
(2 SIDES)
5
1
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45 °
CHAMFER
(DD) DFN REV C 0310
0.25 ± 0.05
0.50 BSC
0.00 – 0.05
2.38 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3990fa
19
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