参数资料
| 型号： | LT3013EFE#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .25A 16-TSSOP |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 95 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.24 V ~ 60 V |
| 输入电压： | 4 V ~ 80 V |
| 电压 - 压降（标准）： | 0.4V @ 250mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 250mA |
| 电流 - 限制（最小）： | 250mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm）裸露焊盘 |
| 供应商设备封装： | 16-TSSOP-EP |
| 包装： | 管件 |
| 产品目录页面： | 1330 (CN2011-ZH PDF) |
LT3013
APPLICATIONS INFORMATION
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat generated
by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32” FR-4 board with one ounce
copper.
Table 1. TSSOP Measured Thermal Resistance
COPPER AREA THERMAL RESISTANCE
Calculating Junction Temperature
Example 1: Given an output voltage of 5V, an input voltage
range of 8V to 12V, an output current range of 0mA to
250mA, and a maximum ambient temperature of 30°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
I OUT(MAX) ? (V IN(MAX) – V OUT ) + (I GND ? V IN(MAX) )
where:
I OUT(MAX) = 250mA
TOPSIDE
2500 sq mm
1000 sq mm
225 sq mm
100 sq mm
BOARD AREA
2500 sq mm
2500 sq mm
2500 sq mm
2500 sq mm
(JUNCTION-TO-AMBIENT)
40°C/W
45°C/W
50°C/W
62°C/W
V IN(MAX) = 12V
I GND at (I OUT = 250mA, V IN = 12V) = 8mA
So:
P = 250mA ? (12V – 5V) + (8mA ? 12V) = 1.85W
Table 2. DFN Measured Thermal Resistance
COPPER AREA THERMAL RESISTANCE
TOPSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
The thermal resistance will be in the range of 40°C/W to
62°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
2500 sq mm
1000 sq mm
2500 sq mm
2500 sq mm
40°C/W
45°C/W
equal to:
1.85W ? 50°C/W = 92.3°C
225 sq mm 2500 sq mm 50°C/W
100 sq mm 2500 sq mm 62°C/W
The thermal resistance junction-to-case ( θ JC ), measured
at the exposed pad on the back of the die, is 16°C/W.
Continuous operation at large input/output voltage dif-
ferentials and maximum load current is not practical
due to thermal limitations. Transient operation at high
input/output differentials is possible. The approximate
thermal time constant for a 2500sq mm 3/32” FR-4 board
with maximum topside and backside area for one ounce
copper is three seconds. This time constant will increase
as more thermal mass is added (i.e., vias, larger board,
and other components).
For an application with transient high power peaks, average
power dissipation can be used for junction temperature
calculations if the pulse period is signi?cantly less than
the thermal time constant of the device and board.
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T JMAX = 30°C + 92.3°C = 122.3°C
Example 2: Given an output voltage of 5V, an input voltage
of 48V that rises to 72V for 5ms(max) out of every 100ms,
and a 5mA load that steps to 200mA for 50ms out of
every 250ms, what is the junction temperature rise above
ambient? Using a 500ms period (well under the time
constant of the board), power dissipation is as follows:
P1(48V in, 5mA load) = 5mA ? (48V – 5V)
+ (200μA ? 48V) = 0.23W
P2(48V in, 50mA load) = 200mA ? (48V – 5V)
+ (8mA ? 48V) = 8.98W
P3(72V in, 5mA load) = 5mA ? (72V – 5V)
+ (200μA ? 72V) = 0.35W
P4(72V in, 50mA load) = 200mA ? (72V – 5V)
+ (8mA ? 72V) = 13.98W
3013fe
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3013HFE | 制造商:Linear Technology 功能描述:LDO Regulator Pos 1.24V to 60V 0.25A 16-Pin TSSOP EP |
| LT3013HFE#PBF | 功能描述:IC REG LDO ADJ .2A 16-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:2.3 V ~ 5.5 V 电压 - 压降（标准）:0.035V @ 150mA 稳压器数量:2 电流 - 输出:150mA 电流 - 限制（最小）:300mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:6-UFDFN 裸露焊盘，6-TMLF? 供应商设备封装:6-TMLF?（1.6x1.6） 包装:Digi-Reel® 产品目录页面:1104 (CN2011-ZH PDF) 其它名称:576-3018-6 |
| LT3013HFE#TRPBF | 功能描述:IC REG LDO ADJ .2A 16-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:2.3 V ~ 5.5 V 电压 - 压降（标准）:0.035V @ 150mA 稳压器数量:2 电流 - 输出:150mA 电流 - 限制（最小）:300mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:6-UFDFN 裸露焊盘，6-TMLF? 供应商设备封装:6-TMLF?（1.6x1.6） 包装:Digi-Reel® 产品目录页面:1104 (CN2011-ZH PDF) 其它名称:576-3018-6 |
| LT3013MPFE | 制造商:Linear Technology 功能描述:LDO Regulator Pos 1.24V to 60V 0.25A 16-Pin TSSOP EP |
| LT3013MPFE#PBF | 功能描述:IC REG LDO ADJ .25A 16-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA（最小值） 电流 - 限制（最小）:360mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
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