参数资料
型号: LT3011EDD#PBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG LDO ADJ 50MA 10-DFN
产品培训模块: LT3011 - 50mA, 3V to 80V Low Dropout Micropower Linear Regulator with PWRGD
More Information on LDOs
标准包装: 121
稳压器拓扑结构: 正,可调式
输出电压: 1.24 V ~ 60 V
输入电压: 2.8 V ~ 80 V
电压 - 压降(标准): 0.3V @ 50mA
稳压器数量: 1
电流 - 输出: 50mA
电流 - 限制(最小): 60mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 管件
产品目录页面: 1330 (CN2011-ZH PDF)
LT3011
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ± 0.05
R = 0.115
TYP
6
10
0.38
± 0.10
3.50 ± 0.05
1.65 ± 0.05
3.00 ± 0.10
1.65 ± 0.10
2.15 ± 0.05 (2 SIDES)
PACKAGE
PIN 1
TOP MARK
(4 SIDES)
(2 SIDES)
OUTLINE
(SEE NOTE 6)
5
1
(DD) DFN 1103
0.25 ± 0.05
0.50
BSC
2.38 ± 0.05
(2 SIDES)
0.200 REF
0.75 ± 0.05
0.00 – 0.05
2.38 ± 0.10
(2 SIDES)
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION
OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS
OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845
(.112
0.102
.004)
0.889
(.035
0.127
.005)
1
2.845
(.112
0.102
.004)
6
0.35
REF
5.23
(.206)
MIN
1.651
(.065
0.102 3.20 – 3.45
.004) (.126 – .136)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B”
THE LEADFRAME FEATURE.
0.42  0.038 0.65
(.0165 .0015) (.0256)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
12 7
4 .039     0.10 2
(.159 .004)
(NOTE 3)
12 11 10 9 8 7
0.406
(.016
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.076
.003)
REF
0.254
DETAIL “A”
GAUGE PLANE
(.010)
0 – 6 TYP
4.90
(.193
0.152
.006)
3.00  0.102
(.118 .004)
(NOTE 4)
0.53
(.021
0.152
.006)
0.18
(.007)
DETAIL “A”
1.10
(.043)
MAX
1 2 3 4 5 6
0.86
(.034)
REF
SEATING
PLANE
0.22 –?0.38
0.1016
0.0508
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
(.009 – .015)
TYP
0.650
(.0256)
BSC
(.004 .002)
MSOP (MSE12) 0608 REV B
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3011f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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