参数资料
型号: IP4385CX4/LF,135
厂商: NXP Semiconductors
文件页数: 12/18页
文件大小: 0K
描述: IC ESD PROTECTION 4WLCSP
标准包装: 1
电压 - 反向隔离(标准值): 5V
电压 - 击穿: 7V
电极标记: 单向
安装类型: 表面贴装
封装/外壳: 4-UFBGA,WLCSP
供应商设备封装: 4-WLCSP(0.76x0.76)
包装: 标准包装
其它名称: 568-7207-6
NXP Semiconductors
IP4085/4385/4386/4387/CX4
Integrated high-performance ESD protection diodes
Table 7.
Package outline dimensions of IP438xCX4 (WLCSP4)
Symbol
A
A 1
A 2
b
D
E
e
Min
0.56
0.18
0.38
0.21
0.71
0.71
0.4
Typ
0.61
0.20
0.41
0.26
0.76
0.76
0.4
Max
0.66
0.22
0.44
0.31
0.76
0.81
0.4
Unit
mm
mm
mm
mm
mm
mm
mm
9. Design and assembly recommendations
9.1 PCB design guidelines
For optimum performance, use a Non-Solder Mask Defined (NSMD), also known as a
copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads
to a buried ground-plane layer. This results in the lowest possible ground inductance and
provides the best high frequency and ESD performance. Refer to Table 8 for the
recommended PCB design parameters.
Table 8.
Parameter
Recommended PCB design parameters
Value or Specification
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
200 ? m
100 ? m (0.004 inch)
370 ? m
20 ? m to 40 ? m
AuNi
FR4
9.2 PCB assembly guidelines for Pb-free soldering
Table 9.
Parameter
Assembly recommendations
Value or Specification
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
330 ? m
100 ? m (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 : 50
IP4085_4385_4386_4387_CX4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 December 2012
? NXP B.V. 2012. All rights reserved.
12 of 18
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