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参数资料
| 型号： | IDT70V3579S6BC8 |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 15/17页 |
| 文件大小： | 0K |
| 描述： | IC SRAM 1.125MBIT 6NS 256BGA |
| 标准包装： | 1,000 |
| 格式 - 存储器： | RAM |
| 存储器类型： | SRAM - 双端口，同步 |
| 存储容量： | 1.125M（32K x 36） |
| 速度： | 6ns |
| 接口： | 并联 |
| 电源电压： | 3.15 V ~ 3.45 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-CABGA（17x17） |
| 包装： | 带卷 (TR) |
| 其它名称： | 70V3579S6BC8 |
IDT70V3579S
High-Speed 32K x 36 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
Functional Description
The IDT70V3579 provides a true synchronous Dual-Port Static
RAM interface. Registered inputs provide minimal set-up and hold
times on address, data, and all critical control inputs. All internal
registers are clocked on the rising edge of the clock signal, however,
the self-timed internal write pulse is independent of the LOW to HIGH
transition of the clock signal.
An asynchronous output enable is provided to ease asyn-
chronous bus interfacing. Counter enable inputs are also provided to
stall the operation of the address counters for fast interleaved
memory applications.
A HIGH on CE 0 or a LOW on CE 1 for one clock cycle will power
down the internal circuitry to reduce static power consumption.
Multiple chip enables allow easier banking of multiple IDT70V3579s
for depth expansion configurations. Two cycles are required with CE 0
LOW and CE 1 HIGH to re-activate the outputs.
A 15
Depth and Width Expansion
The IDT70V3579 features dual chip enables (refer to Truth
Table I) in order to facilitate rapid and simple depth expansion with no
requirements for external logic. Figure 4 illustrates how to control the
various chip enables in order to expand two devices in depth.
The IDT70V3579 can also be used in applications requiring
expanded width, as indicated in Figure 4. Through combining the
control signals, the devices can be grouped as necessary to accom-
modate applications needing 72-bits or wider.
IDT70V3579
CE 0
IDT70V3579
CE 0
Control Inputs
CE 1
V DD
Control Inputs
CE 1
V DD
IDT70V3579
CE 1
IDT70V3579
CE 1
Control Inputs
CE 0
Control Inputs
CE 0
BE ,
R/ W ,
OE ,
CLK,
Figure 4. Depth and Width Expansion with IDT70V3579
15
6.42
4830 drw 14
ADS ,
CNTRST ,
CNTEN
,
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT70V3579S6BCI | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 1.125MBIT 6NS 256CABGA |
| IDT70V3579S6BCI8 | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 1.125MBIT 6NS 256CABGA |
| IDT70V3579S6BF | 功能描述:IC SRAM 1.125MBIT 6NS 208FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
| IDT70V3579S6BF8 | 功能描述:IC SRAM 1.125MBIT 6NS 208FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口，同步 存储容量:1.125M（32K x 36） 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA（17x17） 包装:带卷 (TR) 其它名称:70V3579S5BCI8 |
| IDT70V3579S6DR | 功能描述:IC SRAM 1.125MBIT 6NS 208QFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:带卷 (TR) |
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