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参数资料
| 型号： | HMC5843-EVAL |
| 厂商： | Honeywell Microelectronics & Precision Sensors |
| 文件页数： | 5/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR HMC5843 |
| 特色产品： | 3-Axis Digital Compass IC HMC5843 |
| 标准包装： | 1 |
| 传感器类型： | 磁性，数字式罗盘 |
| 传感范围： | ±4g |
| 接口： | I²C |
| 灵敏度： | 7毫高斯 |
| 电源电压： | 2.5 V ~ 3.3 V |
| 嵌入式： | 否 |
| 已供物品： | 板 |
| 已用 IC / 零件： | HMC5843 |
| 产品目录页面： | 2814 (CN2011-ZH PDF) |
| 相关产品： | 342-1073-ND - BOARD DEMO FOR HMC5843 |
| 其它名称： | 342-1072 |
HMC5843
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC5843.
PCB Pad Definition and Traces
The HMC5843 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.40mm by
0.25mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Size the traces between the HMC5843 and the external
capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
This device is classified as MSL 3 with 260 C peak reflow temperature. A baking process (125 C, 24 hrs) is required if
device is not kept continuously in a dry (< 10% RH) environment before assembly. No special profile is required for the
HMC5843 and compatible with lead eutectic and lead-free solder paste reflow profiles. Honeywell recommends the
adherence to solder paste manufac turer’s guidelines. The HMC 5843 may be reworked with soldering irons, but extreme
care must be taken not to overheat the copper pads from the part’s fiberglass substrate. Irons with a tip temperature no
greater than 315°C should be used. Excessive rework risks the copper pads pulling away into the molten solder.
INTERNAL SCHEMATIC DIAGRAM
HMC5843
www.honeywell.com
5
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC5843-TR | 功能描述:SENSOR MAGNETIC 3 AXIS 20-LCC RoHS:是 类别:传感器，转换器 >> 磁性 - 霍尔效应，数字式开关，线性，罗盘 (IC) 系列:HMC 标准包装:1 系列:- 传感范围:20mT ~ 80mT 类型:旋转 电源电压:4.5 V ~ 5.5 V 电流 - 电源:15mA 电流 - 输出（最大）:- 输出类型:数字式，PWM，8.5 位串行 特点:可编程 工作温度:-40°C ~ 150°C 封装/外壳:20-SSOP（0.209"，5.30mm 宽） 供应商设备封装:20-SSOP 包装:Digi-Reel® 其它名称:AS5132-HSST-500DKR |
| HMC5846LS6 | 功能描述:RF Amplifier IC VSAT, DBS 12GHz ~ 16GHz 16-SMT (6x6) 制造商:analog devices inc. 系列:- 包装:带卷（TR） 零件状态:生命周期结束 频率:12GHz ~ 16GHz P1dB:34.5dBm 增益:31dB 噪声系数:- RF 类型:VSAT，DBS 电压 - 电源:7V 电流 - 电源:1.2A 测试频率:12GHz ~ 16GHz 封装/外壳:16-TFQFN 裸露焊盘 供应商器件封装:16-SMT（6x6） 标准包装:1 |
| HMC584LP5 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:MMIC VCO w/ HALF FREQUENCY OUTPUT & DIVIDE-BY-4, 12.5 - 13.9 GHz |
| HMC584LP5_10 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:MMIC VCO w/ HALF FREQUENCY OUTPUT & DIVIDE-BY-4, 12.5 - 13.9 GHz |
| HMC584LP5E | 制造商:Hittite Microwave Corp 功能描述:IC MMIC VCO HBT BIPOLAR 32-QFN |
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