参数资料
型号: DF24-50DS-0.9C
厂商: Hirose Electric Co Ltd
文件页数: 8/8页
文件大小: 0K
描述: CONN RECEPT 50POS 0.9MM CRIMP
标准包装: 100
系列: DF24
连接器类型: 插座
触点类型:: 母形插口
位置数: 50
间距: 0.035"(0.90mm)
行数: 2
安装类型: 自由悬挂
触点终端: 压接
颜色:
包装: 散装
请注意: 不提供触点
配套产品: DF24A-50DP-0.9V(51)-ND - CONN HEADER 50POS 0.9MM SMD GOLD
相关产品: DF24-36SCFA-ND - CONN SOCKET 36AWG CRIMP GOLD
DF24-3234SCFA-ND - CONN SOCKET 32-34AWG CRIMP GOLD
DF24-2830SCFA-ND - CONN SOCKET 28-30AWG CRIMP GOLD
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
DF24 have ● mm orwillbe Vertical Mating Pleasecheckthe productsstatus
All non-RoHS products Series been 0.9 discontinued, Pitch discontinued soon. Board-to-Wire Connectors the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
7. Precautions
■ Connector Mating/Un-mating
* Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/un-
mating of the connectors must be within the indicated angle of 20° on both axis.
DO NOT MATE /
20°
20°
UN-MATE HOLDING
BY THE WIRES.
Hold here
Fig. 2. Mating / Un-mating
■ Bundling of the Wires
* To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm
min. from the socket (Fig. 3-1)
* When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend
radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3)
Do not stretch
Bundling close to socket
Sharp bend
or twist
Fig. 3-1
Fig. 3-2
Fig. 3-3
Fig. 3. Bundling requirements
* Do not mate/un-mate connectors when not mounted on the board.
* Do not use connector as the only support for the board.
* Do not use flux compounds when hand soldering.
* Slight color shade difference of the insulator bodies will not affect the form, fit or function of the
connectors.
B304
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