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| 型号： | DF24-3234SCFA |
| 厂商： | Hirose Electric Co Ltd |
| 文件页数： | 8/8页 |
| 文件大小： | 0K |
| 描述： | CONN SOCKET 32-34AWG CRIMP GOLD |
| 标准包装： | 20,000 |
| 系列： | DF24 |
| 引脚或插口： | 插口 |
| 触点终端： | 压接 |
| 线规： | 32-34 AWG |
| 触点表面涂层： | 金 |
| 包装： | 带卷 (TR) |
| 配用： | DF24A-50DS-0.9C-ND - CONN RECEPT 50POS 0.9MM CRIMP DF24A-40DS-0.9C-ND - CONN RECEPT 40POS 0.9MM CRIMP DF24-50DS-0.9C-ND - CONN RECEPT 50POS 0.9MM CRIMP DF24-40DS-0.9C-ND - CONN RECEPT 40POS 0.9MM CRIMP |
| 相关产品： | H9996-ND - TOOL HAND EXTRACTION CRIMP SOCKT |
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
DF24 have ● mm orwillbe Vertical Mating Pleasecheckthe productsstatus
All non-RoHS products Series been 0.9 discontinued, Pitch discontinued soon. Board-to-Wire Connectors the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
7. Precautions
■ Connector Mating/Un-mating
* Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/un-
mating of the connectors must be within the indicated angle of 20° on both axis.
DO NOT MATE /
20°
20°
UN-MATE HOLDING
BY THE WIRES.
Hold here
Fig. 2. Mating / Un-mating
■ Bundling of the Wires
* To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm
min. from the socket (Fig. 3-1)
* When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend
radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3)
Do not stretch
Bundling close to socket
Sharp bend
or twist
Fig. 3-1
Fig. 3-2
Fig. 3-3
Fig. 3. Bundling requirements
* Do not mate/un-mate connectors when not mounted on the board.
* Do not use connector as the only support for the board.
* Do not use flux compounds when hand soldering.
* Slight color shade difference of the insulator bodies will not affect the form, fit or function of the
connectors.
B304
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DF24-36SCFA | 功能描述:集管和线壳 SOC 36AWG CRIMP GOLD RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| DF2437FV | 功能描述:IC H8S/2437 MCU FLASH 128QFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2400 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外围设备:DMA，POR，PWM，WDT 输入/输出数:121 程序存储器容量:384KB（384K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b，D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| DF24-40DP-0.9C | 制造商:HRS 制造商全称:HRS 功能描述:0.9 mm Pitch Vertical Mating Board-to-Wire Connectors |
| DF24-40DP-0.9PTB | 制造商:HRS 制造商全称:HRS 功能描述:0.9 mm Pitch Vertical Mating Board-to-Wire Connectors |
| DF24-40DP-0.9V | 制造商:HRS 制造商全称:HRS 功能描述:0.9 mm Pitch Vertical Mating Board-to-Wire Connectors |
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