参数资料
| 型号： | CRA06P083100RFTA |
| 厂商： | Vishay Dale |
| 文件页数： | 3/4页 |
| 文件大小： | 0K |
| 描述： | RES ARRAY 100 OHM 4 RES 1206 |
| 标准包装： | 5,000 |
| 系列： | CRA06 |
| 电路类型： | 隔离 |
| 电阻（欧姆）： | 100 |
| 电阻数： | 4 |
| 引脚数： | 8 |
| 每个元件的功率： | 62.5mW |
| 容差： | ±1% |
| 温度系数： | ±100ppm/°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 1206（3216 公制），凹陷 |
| 尺寸/尺寸： | 0.126" L x 0.063" W（3.20mm x 1.60mm） |
| 高度： | 0.028"（0.70mm） |
| 包装： | 带卷 (TR) |
| 工作温度： | -55°C ~ 155°C |
CRA06P
www.vishay.com
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
Vishay
TEST ?
(clause)
CONDITIONS OF TEST
REQUIREMENTS
PERMISSIBLE CHANGE ( ? R / R ) (1)
STABILITY STABILITY
CLASS 1 OR BETTER
CLASS 2 OR BETTER
Stability for product types:
CRA06P
10 ? to 1 M ?
10 ? to 1 M ?
Resistance (4.5)
Temperature coefficient (4.8.4.2)
Overload (4.13)
-
(20/- 55/20) °C and
(20/125/20) °C
U = 2.5 x ( P 70 x R ) 1/2
? 2 x U max. ; 0.5 s
±1%
± 100 ppm/K
± (0.25 % R + 0.05 ? )
± 2 %; ± 5 %
± 200 ppm/K
± (0.5 % R + 0.05 ? )
Solderability (4.17.5) (2)
Aging 4 h at 155 °C, dryheat
Solder bath method; 235 °C; 2 s
Visual examination
Good tinning ( ? 95 % covered)
no visible damage
Resistance to soldering heat (4.18.2)
Rapid change of temperature (4.19)
Damp heat, steady state (4.24)
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
30 min at LCT = - 55 °C;
30 min at UCT = 125 °C; 5 cycles
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.25 % R + 0.05 ? )
± (0.25 % R + 0.05 ? )
± (1 % R + 0.05 ? )
± (0.5 % R + 0.05 ? )
± (0.5 % R + 0.05 ? )
± (2 % R + 0.1 ? )
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
Climatic sequence (4.23)
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
± (1 % R + 0.05 ? )
± (2 % R + 0.1 ? )
U = ( P 70 x R ) 1/2
U = U max. ; whichever is less severe
U = ( P 70 x R ) 1/2
Endurance at 70 °C (4.25.1)
U = U max. ; whichever is less severe
1.5 h “ON”; 0.5 h “OFF”;
± (1 % R + 0.05 ? )
± (2 % R + 0.1 ? )
70 °C; 1000 h
Extended endurance (4.25.1.8)
Endurance at upper category
temperature (4.25.3)
Duration extended to 8000 h
UCT = 125 °C; 1000 h
± (2 % R + 0.1 ? )
± (1 % R + 0.05 ? )
± (4 % R + 0.1 ? )
± (2 % R + 0.1 ? )
Notes
(1) Figures are given for a single element.
(2) Solderability is specified for 2 years after production or requalification. Permitted storage time is 20 years.
APPLICABLE SPECIFICATIONS
? EN 60115-1
? EN 140400
? EN 140401-802
? IEC 60068-2-X
? EIA 481
Generic specification ?
Sectional specification ?
Detail specification ?
Variety of environmental test procedures ?
Packaging of SMD components
Revision: 24-Jun-13
3
Document Number: 31047
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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