参数资料
型号: CM1631-04DE
厂商: ON Semiconductor
文件页数: 14/16页
文件大小: 0K
描述: IC LCD/CAM EMI FILTER 4CH 8DFN
产品变化通告: Product Obsolescence 30/Jun/2011
标准包装: 3,000
类型: 低通
技术: RC(Pi)
通道数: 4
中心 / 截止频率: 110MHz(截止值)
衰减值: 30dB @ 800MHz ~ 6GHz
电阻 - 通道 (Ohms): 100
值: R = 100 欧姆,C = 15pF
ESD 保护:
滤波器阶数: 2nd
应用: 移动设备的数据线路
封装/外壳: 8-UFDFN 裸露焊盘
尺寸/尺寸: 0.067" L x 0.053" W(1.70mm x 1.35mm)
高度: 0.022"(0.55mm)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
CM1631
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC ? 01
ISSUE O
C
EXPOSED Cu
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
0.05 C
8X 0.05 C
NOTE 4
D
TOP VIEW
DETAIL B
SIDE VIEW
A1
A
B
E
A
(A3)
SEATING
PLANE
L1
MOLD CMPD
A1 A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.70 BSC
D2 1.10 1.30
E 1.35 BSC
E2 0.30 0.50
e 0.40 BSC
K 0.15 ???
L 0.20 0.30
L1 ??? 0.05
8X
DETAIL A
L
1
D2
E2
RECOMMENDED
SOLDERING FOOTPRINT*
8X
K
8
8X b
1.40
8X
0.40
e
e/2
BOTTOM VIEW
0.10 C A B
0.05 C NOTE 3
PACKAGE
OUTLINE
0.50
1.55
8X
0.25
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
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