参数资料
型号: CM100TF-12H
厂商: Powerex Inc
文件页数: 2/4页
文件大小: 0K
描述: IGBT MOD 6PAC 600V 100A H SER
标准包装: 1
系列: IGBTMOD™
配置: 三相反相器
电压 - 集电极发射极击穿(最大): 600V
Vge, Ic时的最大Vce(开): 2.8V @ 15V,100A
电流 - 集电极 (Ic)(最大): 100A
电流 - 集电极截止(最大): 1mA
Vce 时的输入电容 (Cies): 10nF @ 10V
功率 - 最大: 400W
输入: 标准
NTC 热敏电阻:
安装类型: 底座安装
封装/外壳: 模块
供应商设备封装: 模块
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
CM100TF-12H
Six-IGBT IGBTMOD? H-Series Module
100 Amperes/600 Volts
Absolute Maximum Ratings, T j = 25 ° C unless otherwise specified
Ratings
Junction Temperature
Storage Temperature
Collector-Emitter Voltage (G-E SHORT)
Gate-Emitter Voltage
Collector Current
Peak Collector Current
Diode Forward Current
Diode Forward Surge Current
Power Dissipation
Max. Mounting Torque M4 Terminal Screws
Max. Mounting Torque M5 Mounting Screws
Module Weight (Typical)
V Isolation
Symbol
T j
T stg
V CES
V GES
I C
I CM
I F
I FM
P d
V RMS
CM100TF-12H
–40 to 150
–40 to 125
600
± 20
100
200*
100
200*
400
13
17
540
2500
Units
° C
° C
Volts
Volts
Amperes
Amperes
Amperes
Amperes
Watts
in-lb
in-lb
Grams
Volts
* Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating.
Static Electrical Characteristics, T j = 25 ° C unless otherwise specified
Characteristics
Collector-Cutoff Current
Gate Leakage Current
Gate-Emitter Threshold Voltage
Collector-Emitter Saturation Voltage
Total Gate Charge
Diode Forward Voltage
Symbol
I CES
I GES
V GE(th)
V CE(sat)
Q G
V FM
Test Conditions
V CE = V CES , V GE = 0V
V GE = V GES , V CE = 0V
I C = 10mA, V CE = 10V
I C = 100A, V GE = 15V
I C = 100A, V GE = 15V, T j = 150 ° C
V CC = 300V, I C = 100A, V GS = 15V
I E = 100A, V GS = 0V
Min.
4.5
Typ.
6.0
2.1
2.15
300
Max.
1.0
0.5
7.5
2.8**
2.8
Units
mA
μ A
Volts
Volts
Volts
nC
Volts
** Pulse width and repetition rate should be such that device junction temperature rise is negligible.
Dynamic Electrical Characteristics, T j = 25 ° C unless otherwise specified
Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Symbol
C ies
C oes
C res
Test Conditions
V GE = 0V, V CE = 10V, f = 1MHz
Min.
Typ.
Max.
10
3.5
2
Units
nF
nF
nF
Resistive
Turn-on Delay Time
t d(on)
120
ns
Load
Switching
Times
Rise Time
Turn-off Delay Time
Fall Time
t r
t d(off)
t f
V CC = 300V, I C = 100A,
V GE1 = V GE2 = 15V, R G = 6.3 ?
300
200
300
ns
ns
ns
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
t rr
Q rr
I E = 100A, di E /dt = –200A/ μ s
I E = 100A, di E /dt = –200A/ μ s
0.27
110
ns
μ C
Thermal and Mechanical Characteristics, T j = 25 ° C unless otherwise specified
Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance
Symbol
R th(j-c)
R th(j-c)
R th(c-f)
Test Conditions
Per IGBT
Per FWDi
Per Module, Thermal Grease Applied
Min.
Typ.
Max.
0.31
0.70
0.033
Units
° C/W
° C/W
° C/W
316
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