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参数资料
| 型号： | CKP2012N1R0M-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 26/29页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR 1.0UH MULTILAYER 0805 |
| 标准包装： | 1 |
| 系列： | CK |
| 电感： | 1µH |
| 电流： | 1A |
| 容差： | ±20% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 140 毫欧 |
| 封装/外壳： | 0805（2012 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 频率 - 测试： | 1MHz |
| 其它名称： | 587-2769-6 |
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Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
c
d
c
Recommended land dimension for Reflow-soldering
Type
3216
2010
1210
0806
0605
Size
L 3.2 2.0 1.25 0.85 0.65
W 1.6 1.0 1.0 0.65 0.50
a 0.7～0.9 0.5～0.6
0.45～0.55 0.25～0.35 0.27～0.33
d
b 0.8～1.0
0.5～0.6
0.7～0.8
0.25～0.35 0.17～0.23
（（2） Examples of good and bad solder application
c 0.4～0.5
d 0.8
（Unit：mm）
0.2～0.3
0.5
0.25～0.35 0.25～0.35 0.20～0.26
0.55 0.5 0.4
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Deflection of the board
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E02R01
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相关代理商/技术参数 |
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| CKP2012N1R5M | 功能描述:INDUCTOR 1.5UH MULTILAYER 0805 RoHS:是 类别:电感器，线圈，扼流圈 >> 固定式 系列:CK 标准包装:500 系列:1331 电感:1.2µH 电流:247mA 电流 - 饱和:247mA 电流 - 温升:- 类型:铁芯体 容差:±10% 屏蔽:屏蔽 DC 电阻(DCR):最大 730 毫欧 Q因子@频率:40 @ 7.9MHz 频率 - 自谐振:130MHz 材料 - 芯体:铁 封装/外壳:0.312" L x 0.115" W x 0.135" H（7.94mm x 2.92mm x 3.43mm） 安装类型:表面贴装 包装:带卷 (TR) 工作温度:-55°C ~ 105°C 频率 - 测试:7.9MHz |
| CKP2012N1R5M-T | 功能描述:固定电感器 INDCTR HICUR MLTLYR 0805 1.5uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| CKP2012N2R2M | 制造商:TAIYO YUDEN 功能描述:INDUCTOR HI CURR MULTILAYER 0805 2.2UH?20% - Tape and Reel |
| CKP2012N2R2M-T | 功能描述:固定电感器 INDCTR HICUR MLTLYR 0805 2.2uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| CKP2012N3R3M | 制造商:TAIYO YUDEN 功能描述:INDUCTOR HI CURR MULTILAYER 0805 3.3UH?20% - Tape and Reel |
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