参数资料
型号: ADMP521ACEZ-RL
厂商: Analog Devices Inc
文件页数: 5/17页
文件大小: 0K
描述: IC MEMS MICROPHONE ULT LN LGA
标准包装: 1
系列: ADMP521
类型: MEMS(硅)- 数字
输出类型: 数字,PDM
方向: 全向
频率范围: 100Hz ~ 16kHz
灵敏度: -26dB ±3dB
信噪比: 65dB
电压 - 额定: 1.6 ~ 3.3V
电流 - 电源: 1.2mA
端口位置: 底部
密封等级:
端子: 焊盘
尺寸/尺寸: 0.157" L x 0.118" W(4.00mm x 3.00mm)
高度(最大): 1.10mm
形状: 矩形
包装: 标准包装
其它名称: ADMP521ACEZ-RLDKR
ADMP521
Data Sheet
Rev. A | Page 12 of 16
ALTERNATIVE PCB LAND PATTERNS
The standard PCB land pattern of the ADMP521 has a solid ring
around the edge of the footprint that may make routing the
microphone signals more difficult in some board designs. This
ring is used to improve the RF immunity performance of the
ADMP521; however, it is not necessary to have this full ring
connected for electrical functionality. If a design can tolerate
reduced RF immunity, this ring can either be broken or removed
completely from the PCB footprint. Figure 17 shows an example
PCB land pattern with no enclosing ring around the edge of the
part, and Figure 18 shows an example PCB land pattern with the
ring broken on two sides so that the inner pads can be more
easily routed on the PCB.
10141-
017
Figure 17. Example PCB Land Pattern with No Enclosing Ring
10141-
018
Figure 18. Example PCB Land Pattern with Broken Enclosing Ring
Note that in both of these patterns, the solid ring around the sound
port is still present; this ring is needed to ground the microphone
and for acoustic performance. The pad on the package connected
to this ring is ground and still needs a solid electrical connection to
the PCB ground. If a pattern like one of these two examples is
used on a PCB, take care that the unconnected ring on the bottom
of the ADMP521 is not placed directly over any exposed copper.
This ring on the microphone is still at ground and any PCB traces
routed underneath it need to be properly masked to avoid short
circuits.
PCB MATERIAL AND THICKNESS
The performance of the ADMP521 is not affected by PCB
thickness and can be mounted on both a rigid and flexible PCB.
A flexible PCB with the microphone can be attached directly to
the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port, while providing the
shortest acoustic path for good sound quality.
OBSOLETE
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